Aspandiar; Raiyomand F.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Aspandiar; Raiyomand F..The latest application filed is for "decoupling layer to reduce underfill stress in semiconductor devices".

Company Profile

1.10.14

Aspandiar; Raiyomand F. - Portland OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Decoupling Layer To Reduce Underfill Stress In Semiconductor Devices App 20210066882 - Dobriyal; Priyanka ; et al.	2021-03-04
Apparatus and method for conformal coating of integrated circuit packages Grant 10,356,912 - Dobriyal , et al. July 16, 2	2019-07-16
Conformal Coating Of Integrated Circuit Packages App 20180070456 - Dobriyal; Priyanka ; et al.	2018-03-08
Method and structure for identifying lead-free solder Grant 7,251,880 - Pearson , et al. August 7, 2	2007-08-07
Soldered heat sink anchor and method of use Grant 7,183,496 - Arrigotti , et al. February 27, 2	2007-02-27
Extension mechanism and method for assembling overhanging components Grant 6,917,524 - Pearson , et al. July 12, 2	2005-07-12
Extension mechanism and method for assembling overhanging components App 20050014419 - Pearson, Tom E. ; et al.	2005-01-20
Soldered heat sink anchor and method of use App 20040207076 - Arrigotti, George ; et al.	2004-10-21
Extension mechanism and method for assembling overhanging components Grant 6,801,436 - Pearson , et al. October 5, 2	2004-10-05
Interposer to couple a microelectronic device package to a circuit board Grant 6,791,035 - Pearson , et al. September 14, 2	2004-09-14
Soldered heat sink anchor and method of use Grant 6,734,371 - Arrigotti , et al. May 11, 2	2004-05-11
Retainer for circuit board assembly and method for using the same Grant 6,700,800 - Combs , et al. March 2, 2	2004-03-02
Interposer to couple a microelectronic device package to a circuit board App 20040003496 - Pearson, Thomas E. ; et al.	2004-01-08
Retainer For Circuit Board Assembly And Method For Using The Same App 20030231481 - Combs, Christopher ; et al.	2003-12-18
Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering Grant 6,651,869 - Aspandiar , et al. November 25, 2	2003-11-25
Interposer to couple a microelectronic device package to a circuit board App 20030156396 - Pearson, Thomas E. ; et al.	2003-08-21
Zero mounting force solder-free connector/component and method App 20030124885 - Combs, Christopher D. ; et al.	2003-07-03
Extension mechanism and method for assembling overhanging components App 20030061709 - Pearson, Tom E. ; et al.	2003-04-03
Method and structure for identifying lead-free solder App 20030062192 - Pearson, Tom E. ; et al.	2003-04-03
Soldered heat sink anchor and method of use App 20030062195 - Arrigotti, George ; et al.	2003-04-03
Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering App 20030057265 - Aspandiar, Raiyomand F. ; et al.	2003-03-27
Heatsink mounting with shock absorbers Grant 6,501,658 - Pearson , et al. December 31, 2	2002-12-31
Surface mount component App 20020148638 - Fartash, Arjang ; et al.	2002-10-17
Heatsink mounting with shock absorbers App 20020114137 - Pearson, Tom E. ; et al.	2002-08-22

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