ASM Assembly Materials Ltd.
Patent Applications and Registrations
Patent applications and USPTO patent grants for ASM Assembly Materials Ltd..The latest application filed is for "stamped leadframe and method of manufacture thereof".
- ASM Assembly Materials Ltd. - Hong Kong CN
- ASM Assembly Materials Ltd - Hong Kong HK
- ASM Assembly Materials Ltd. -
- ASM Assembly Materials Ltd. - SG SG
| Patent | Date |
|---|---|
| Stamped leadframe and method of manufacture thereof Grant 8,174,096 - Chi Chan , et al. May 8, 2 | 2012-05-08 |
| Leadframe treatment for enhancing adhesion of encapsulant thereto Grant 8,012,886 - Kwan , et al. September 6, 2 | 2011-09-06 |
| Pre-plated leadframe having enhanced encapsulation adhesion Grant 7,691,679 - Kwan , et al. April 6, 2 | 2010-04-06 |
| Stamped leadframe and method of manufacture thereof App 20080122048 - Chan; Tat Chi ; et al. | 2008-05-29 |
| Leadframe with enhanced encapsulation adhesion Grant 7,125,750 - Kwan , et al. October 24, 2 | 2006-10-24 |
| Leadframe with enhanced encapsulation adhesion App 20060110855 - Kwan; Yiu Fai ; et al. | 2006-05-25 |
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