ASIA PACIFIC PTE. LTD.; STMICROELECTRONICS
Patent Applications and Registrations
Patent applications and USPTO patent grants for ASIA PACIFIC PTE. LTD.; STMICROELECTRONICS.The latest application filed is for "ink jet printhead device with compressive stressed dielectric layer".
- ASIA PACIFIC PTE. LTD.; STMICROELECTRONICS - Coppell TX US
- ASIA PACIFIC PTE. LTD.; STMICROELECTRONICS - US
| Patent | Date |
|---|---|
| Ink Jet Printhead Device With Compressive Stressed Dielectric Layer App 20140340450 - KUNNAVAKKAM; MADANAGOPAL ; et al. | 2014-11-20 |
| Multiple Row Receiving Line Pattern For In-cell Touchscreen Panels App 20140306921 - Ningrat; Kusuma Adi | 2014-10-16 |
| Single Layer Sensor Pattern App 20140197880 - NG; Chee Yu ; et al. | 2014-07-17 |
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