| Patent | Date |
|---|
Piezoresistive pressure sensor
Grant 10,156,489 - Yin , et al. Dec | 2018-12-18 |
Piezoresistive Pressure Sensor
App 20170219449 - Yin; Hung-Lin ; et al. | 2017-08-03 |
Integrated MEMS device
Grant 9,676,609 - Hsieh June 13, 2 | 2017-06-13 |
Method for fabricating semiconductor devices having reinforcing elements
Grant 9,553,055 - Yin January 24, 2 | 2017-01-24 |
Diaphragm piezoresistive pressure sensor
Grant 9,459,172 - Chen October 4, 2 | 2016-10-04 |
Integrated MEMS Device
App 20160244323 - Hsieh; Jerwei | 2016-08-25 |
Method For Fabricating Semiconductor Devices Having Reinforcing Elements
App 20160240490 - Yin; Hung-Lin | 2016-08-18 |
Method for fabricating a self-aligned vertical comb drive structure
Grant 9,382,113 - Hsieh , et al. July 5, 2 | 2016-07-05 |
Method for manufacturing an integrated MEMS device
Grant 9,359,193 - Hsieh June 7, 2 | 2016-06-07 |
Integrated Mems Device and Its Manufacturing Method
App 20150274514 - Hsieh; Jerwei | 2015-10-01 |
Method For Fabricating Semiconductor Devices Having High-precision Gaps
App 20150279664 - Yin; Hung-Lin | 2015-10-01 |
Diaphragm Piezoresistive Pressure Sensor
App 20150114129 - Chen; Ming-Yan | 2015-04-30 |
Package structure and substrate bonding method
Grant 8,916,449 - Yin , et al. December 23, 2 | 2014-12-23 |
Method for Fabricating a Self-Aligned Vertical Comb Drive Structure
App 20140126031 - Hsieh; Jer-Wei ; et al. | 2014-05-08 |
Package Structure and Substrate Bonding Method
App 20130285248 - Yin; Hung-Lin ; et al. | 2013-10-31 |
Combo Transducer and Combo Transducer Package
App 20130205899 - Wu; Chang-Wen ; et al. | 2013-08-15 |
Method for making micro-electromechanical system devices
Grant 7,824,945 - Chang , et al. November 2, 2 | 2010-11-02 |
Electrostatically operated micro-optical devices and method for manufacturing thereof
Grant 6,996,306 - Chen , et al. February 7, 2 | 2006-02-07 |
Wireless tire pressure and temperature monitoring system
App 20050274442 - Huang, Morris ; et al. | 2005-12-15 |
Method of maintaining photolithographic precision alignment after wafer bonding process
Grant 6,967,145 - Tseng , et al. November 22, 2 | 2005-11-22 |
Film bulk acoustic device with integrated tunable and trimmable device
Grant 6,924,583 - Lin , et al. August 2, 2 | 2005-08-02 |
Retro-reflective type optical signal processing device and method
Grant 6,901,182 - Yeh , et al. May 31, 2 | 2005-05-31 |
Fabrication process for bonded wafer precision layer thickness control and its non-destructive measurement method
Grant 6,864,176 - Wang , et al. March 8, 2 | 2005-03-08 |
Electrostatically operated micro-optical devices and method for manufacturing thereof
App 20050047721 - Chen, Chih-Chung ; et al. | 2005-03-03 |
Method of maintaining photolithographic precision alignment after wafer bonding process
App 20050013019 - Tseng, Chung-Yang ; et al. | 2005-01-20 |
Silicon pressure sensor and the manufacturing method thereof
Grant 6,838,303 - Wang , et al. January 4, 2 | 2005-01-04 |
Retro-reflective type optical signal processing device and method
App 20040240779 - Yeh, Jer-Liang A. ; et al. | 2004-12-02 |
Optical switch
Grant 6,804,036 - Chen , et al. October 12, 2 | 2004-10-12 |
Silicon pressure sensor and the manufacturing method thereof
App 20040183150 - Wang, Hung-Dar ; et al. | 2004-09-23 |
Package structure and method for making the same
Grant 6,784,020 - Lee , et al. August 31, 2 | 2004-08-31 |
Package Structure And Method For Making The Same
App 20040087043 - Lee, Chenkuo ; et al. | 2004-05-06 |
Apparatus and method for optical signal processing system
App 20040086218 - Liu, Chun-Kai ; et al. | 2004-05-06 |
Method for inductor trimming of the high frequency integrated passive devices
App 20040063039 - Liang, Shang-Yu ; et al. | 2004-04-01 |
Bulk acoustic wave multiplexer
Grant 6,703,763 - Tsai , et al. March 9, 2 | 2004-03-09 |
Three-dimensional intergrated inductor, its module and fabrication method of the same
App 20040036569 - Tsai, Shu-Hui ; et al. | 2004-02-26 |
Optical signal processing apparatus based on movable tilted reflection mirror
App 20040037493 - Lee, Chongkuo ; et al. | 2004-02-26 |
Thin film acoustic wave device and the manufacturing method thereof
App 20040007940 - Tsai, Shu-Hui ; et al. | 2004-01-15 |
Fabrication process for bonded wafer precision layer thickness control and its non-destructructive measurement method
App 20030224610 - Wang, Hung-Dar ; et al. | 2003-12-04 |
Film bulk acoustic device with integrated tunable and trimmable device
App 20030205948 - Lin, Chung-Hsien ; et al. | 2003-11-06 |
Method for manufacturing a film bulk acoustic wave filter
App 20030000058 - Tsai, Shu-Hui ; et al. | 2003-01-02 |
Manufacturing method for a high quality film bulk acoustic wave device
App 20020189062 - Lin, Chung-Hsien ; et al. | 2002-12-19 |
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