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Patent applications and USPTO patent grants for Ashiwake; Noriyuki.The latest application filed is for "liquid cooling system and personal computer using the same".
Patent | Date |
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Liquid cooling system and personal computer using thereof Grant 6,987,668 - Kitano , et al. January 17, 2 | 2006-01-17 |
Liquid cooling system and personal computer using the same Grant 6,972,954 - Minamitani , et al. December 6, 2 | 2005-12-06 |
Liquid cooling system and personal computer using the same App 20050157466 - Minamitani, Rintaro ;   et al. | 2005-07-21 |
Liquid cooling system and personal computer using the same Grant 6,873,525 - Minamitani , et al. March 29, 2 | 2005-03-29 |
Liquid cooling system and personal computer using thereof App 20040233635 - Kitano, Makoto ;   et al. | 2004-11-25 |
Liquid cooling system and personal computer using the same App 20040228088 - Minamitani, Rintaro ;   et al. | 2004-11-18 |
Liquid cooling system and personal computer using thereof Grant 6,741,464 - Kitano , et al. May 25, 2 | 2004-05-25 |
Electronic apparatus App 20040037035 - Ohashi, Shigeo ;   et al. | 2004-02-26 |
Liquid cooling system and personal computer using thereof Grant 6,697,253 - Minamitani , et al. February 24, 2 | 2004-02-24 |
Electronic apparatus Grant 6,611,425 - Ohashi , et al. August 26, 2 | 2003-08-26 |
Electronic apparatus App 20020105781 - Ohashi, Shigeo ;   et al. | 2002-08-08 |
Liquid cooling system and personal computer using thereof App 20020075645 - Kitano, Makoto ;   et al. | 2002-06-20 |
Liquid cooling system and personal computer using thereof App 20020075646 - Minamitani, Rintaro ;   et al. | 2002-06-20 |
Electronic apparatus Grant 6,292,365 - Ashiwake , et al. September 18, 2 | 2001-09-18 |
Liquid-cooled electronic device Grant 5,959,351 - Sasaki , et al. September 28, 1 | 1999-09-28 |
Low thermal resistant, fluid-cooled semiconductor module Grant 5,774,334 - Kawamura , et al. June 30, 1 | 1998-06-30 |
Cooling device of multi-chip module Grant 5,751,062 - Daikoku , et al. May 12, 1 | 1998-05-12 |
Cooling device of semiconductor chips Grant RE35,721 - Daikoku , et al. February 3, 1 | 1998-02-03 |
Semiconductor module Grant 5,705,850 - Ashiwake , et al. January 6, 1 | 1998-01-06 |
Cooling apparatus of electronic devices Grant 5,595,240 - Daikoku , et al. January 21, 1 | 1997-01-21 |
Cooling apparatus of electronic devices Grant 5,515,912 - Daikoku , et al. May 14, 1 | 1996-05-14 |
Cooling device for semiconductor packages, having flexible film heat expulsion means Grant 5,488,255 - Sato , et al. January 30, 1 | 1996-01-30 |
Apparatus for cooling semiconductor device and computer having the same Grant 5,406,807 - Ashiwake , et al. April 18, 1 | 1995-04-18 |
Heat sinks and semiconductor cooling device using the heat sinks Grant 5,365,400 - Ashiwake , et al. November 15, 1 | 1994-11-15 |
Cooling apparatus for electronic device Grant 5,345,107 - Daikoku , et al. * September 6, 1 | 1994-09-06 |
Liquid impingement cooling module for semiconductor devices Grant 5,270,572 - Nakajima , et al. December 14, 1 | 1993-12-14 |
Cooling apparatus for electronic device Grant 5,126,829 - Daikoku , et al. June 30, 1 | 1992-06-30 |
Cooling device of semiconductor chips Grant 4,770,242 - Daikoku , et al. September 13, 1 | 1988-09-13 |
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