Asanuma; Takumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Asanuma; Takumi.The latest application filed is for "thermoplastic resin film".

Company Profile

6.16.15

Asanuma; Takumi - Tokyo JP
Asanuma; Takumi - Ibi-Gun N/A JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Adhesive composition, and method of bonding an adherend and method of producing a stack, each of which uses the same Grant 10,988,646 - Mieda , et al. April 27, 2	2021-04-27
Thermoplastic Resin Film App 20210061998 - ASANUMA; Takumi ; et al.	2021-03-04
Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device Grant 10,829,669 - Mieda , et al. November 10, 2	2020-11-10
Curable and hygroscopic resin composition for sealing electronic devices, sealing resin, and electronic device Grant 10,556,974 - Mieda , et al. Feb	2020-02-11
Resin composition for sealing electronic device, and electronic device Grant 10,196,534 - Asanuma , et al. Fe	2019-02-05
Resin composition for sealing electronic device, and electronic device Grant 10,196,547 - Aoyama , et al. Fe	2019-02-05
Adhesive Composition, And Method Of Bonding An Adherend And Method Of Producing A Stack, Each Of Which Uses The Same App 20180291242 - MIEDA; Tetsuya ; et al.	2018-10-11
Resin composition for sealing electronic devices, and electronic device Grant 10,079,360 - Mieda , et al. September 18, 2	2018-09-18
Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display device Grant 10,043,996 - Aoyama , et al. August 7, 2	2018-08-07
Curable And Hygroscopic Resin Composition For Sealing Electronic Devices, Resin Cured Material, And Electronic Device App 20180208804 - MIEDA; Tetsuya ; et al.	2018-07-26
Resin Composition For Sealing Electronic Devices, And Electronic Device App 20170331070 - MIEDA; Tetsuya ; et al.	2017-11-16
Curable And Hygroscopic Resin Composition For Sealing Electronic Devices, Sealing Resin, And Electronic Device App 20170327608 - MIEDA; Tetsuya ; et al.	2017-11-16
Transparent resin composition for sealing organic electroluminescence element, resin sheet for sealing organic electroluminescence element, and apparatus for displaying image Grant 9,758,690 - Ishiguro , et al. September 12, 2	2017-09-12
Resin Composition For Sealing Electronic Device, And Electronic Device App 20160362587 - AOYAMA; Masami ; et al.	2016-12-15
Resin Composition For Sealing Electronic Device, And Electronic Device App 20160362576 - ASANUMA; Takumi ; et al.	2016-12-15
Sealant Composition And Sealing Sheet Obtained From The Composition App 20160017186 - AOYAMA; Masami ; et al.	2016-01-21
Resin Composition For Element Encapsulation For Organic Electronic Devices, Resin Sheet For Element Encapsulation For Organic Electronic Devices, Organic Electroluminescent Element, And Image Display Device App 20160020426 - AOYAMA; Masami ; et al.	2016-01-21
Transparent Resin Composition For Sealing Organic Electroluminescence Element, Resin Sheet For Sealing Organic Electroluminescence Element, And Apparatus For Displaying Image App 20150291824 - ISHIGURO; Kunihiko ; et al.	2015-10-15
Honeycomb structure and method for manufacturing honeycomb structure Grant 9,023,453 - Ido , et al. May 5, 2	2015-05-05
Honeycomb structure Grant 8,715,579 - Ido , et al. May 6, 2	2014-05-06
Honeycomb structural body and exhaust gas conversion apparatus Grant 8,506,894 - Ido , et al. August 13, 2	2013-08-13
Honeycomb structural body and exhaust gas conversion apparatus Grant 8,435,455 - Ido , et al. May 7, 2	2013-05-07
Honeycomb Structural Body And Exhaust Gas Conversion Apparatus App 20110250095 - IDO; Takahiko ; et al.	2011-10-13
Honeycomb Structure And Method For Manufacturing Honeycomb Structure App 20110250382 - IDO; Takahiko ; et al.	2011-10-13
Honeycomb Structure App 20110250097 - IDO; Takahiko ; et al.	2011-10-13
Honeycomb Structural Body And Exhaust Gas Conversion Apparatus App 20110250094 - IDO; Takahiko ; et al.	2011-10-13
Honeycomb Structure App 20110250096 - IDO; Takahiko ; et al.	2011-10-13

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