Asano; Toyofumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Asano; Toyofumi.The latest application filed is for "sealing material for liquid crystal and method for producing same".

Company Profile

0.6.11

Asano; Toyofumi - Saitama JP
Asano; Toyofumi - Saitama-shi JP
Asano; Toyofumi - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sealant for liquid crystal and liquid-crystal display cell made with the same Grant 7,678,433 - Ochi , et al. March 16, 2	2010-03-16
Sealing material for liquid crystal and method for producing same App 20090188616 - Imaizumi; Masahiro ; et al.	2009-07-30
Sealing Agent for Photoelectric Converter and Photoelectric Converter Using Same App 20090114272 - Inoue; Teruhisa ; et al.	2009-05-07
Liquid crystal sealing agent and liquid crystalline display cell using the same Grant 7,521,100 - Imaizumi , et al. April 21, 2	2009-04-21
Adhesive aid composition Grant 7,517,553 - Uchida , et al. April 14, 2	2009-04-14
Sealing Material for Liquid Crystal and Method for Producing Same App 20080063816 - Imalzumi; Masahiro ; et al.	2008-03-13
Adhesive aid composition App 20070026227 - Uchida; Makoto ; et al.	2007-02-01
Sealant for liquid crystal and liquid-crystal display cell made with the same App 20070020405 - Ochi; Naoyuki ; et al.	2007-01-25
Liquid crystal sealing agent and liquid crystalline display cell using the same App 20060208219 - Imaizumi; Masahiro ; et al.	2006-09-21
Polyamide resin-containing varnish and its use Grant 6,956,100 - Imaizumi , et al. October 18, 2	2005-10-18
Cover-lay film and printed circuit board having the same Grant 6,794,031 - Murakami , et al. September 21, 2	2004-09-21
Polyphenol resin, method for producing the same, epoxy resin composition and use thereof App 20040166326 - Akatsuka, Yasumasa ; et al.	2004-08-26
Polyphenol resin, process for its production, epoxy resin composition and its use Grant 6,723,801 - Akatsuka , et al. April 20, 2	2004-04-20
Varnish containing polyamide resin and use thereof App 20040024124 - Imaizumi, Masahiro ; et al.	2004-02-05
Epoxy resin composition and cured object obtained therefrom App 20030166796 - Imaizumi, Masahiro ; et al.	2003-09-04
Cover-lay film and printed circuit board having the same App 20030091842 - Murakami, Tooru ; et al.	2003-05-15
Polyphenol resin, process for its production, epoxy resin composition and its use App 20030009001 - Akatsuka, Yasumasa ; et al.	2003-01-09

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