Asano; Toshiya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Asano; Toshiya.The latest application filed is for "method for manufacturing wiring board".

Company Profile

0.16.14

Asano; Toshiya - Ichinomiya JP
ASANO; Toshiya - Ichinomiya-shi JP
Asano; Toshiya - Nagoya JP
Asano; Toshiya - Utsunomiya JP
Asano; Toshiya - Tochigi JP
Asano; Toshiya - Utsunomiya-shi JP
Asano; Toshiya - Aichi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wiring board assembly and manufacturing method thereof Grant 8,362,364 - Asano , et al. January 29, 2	2013-01-29
Method For Manufacturing Wiring Board App 20120204420 - ASANO; Toshiya ; et al.	2012-08-16
Multilayer wiring substrate and method for manufacturing the same Grant 8,233,289 - Maeda , et al. July 31, 2	2012-07-31
Multilayer wiring board and method of manufacturing the same Grant 8,153,909 - Katagiri , et al. April 10, 2	2012-04-10
Multi-layer wiring board and method of manufacturing the same Grant 8,110,754 - Asano February 7, 2	2012-02-07
Multilayer wiring board Grant 8,093,503 - Katagiri , et al. January 10, 2	2012-01-10
Multi-layer wiring board and method of manufacturing the same Grant 8,035,035 - Asano October 11, 2	2011-10-11
Intermediate multilayer wiring board product, and method for manufacturing multilayer wiring board Grant 7,977,580 - Ueno , et al. July 12, 2	2011-07-12
Wiring Board Assembly And Manufacturing Method Thereof App 20100208442 - ASANO; Toshiya ; et al.	2010-08-19
Multilayer Wiring Substrate And Method For Manufacturing The Same App 20100208437 - MAEDA; Shinnosuke ; et al.	2010-08-19
Intermediate Multilayer Wiring Board Product, And Method For Manufacturing Multilayer Wiring Board App 20090294156 - UENO; Seigo ; et al.	2009-12-03
Multi-layer Wiring Board And Method Of Manufacturing The Same App 20090242245 - Asano; Toshiya	2009-10-01
Multi-layer Wiring Board And Method Of Manufacturing The Same App 20090242262 - Asano; Toshiya	2009-10-01
Multilayer Wiring Board And Method Of Manufacturing The Same App 20090236138 - KATAGIRI; Hiroshi ; et al.	2009-09-24
Multilayer Wiring Board App 20090229874 - KATAGIRI; Hiroshi ; et al.	2009-09-17
Linear motor, moving stage system, exposure apparatus, and device manufacturing method Grant 7,348,695 - Korenaga , et al. March 25, 2	2008-03-25
Alignment apparatus, exposure apparatus, and device manufacturing method Grant 7,330,093 - Asano , et al. February 12, 2	2008-02-12
Alignment apparatus, exposure apparatus, and device manufacturing method Grant 7,193,493 - Asano , et al. March 20, 2	2007-03-20
Linear motor, moving stage system, exposure apparatus, and device manufacturing method Grant 7,067,942 - Korenaga , et al. June 27, 2	2006-06-27
Linear motor, moving stage system, exposure apparatus, and device manufacturing method App 20060082225 - Korenaga; Nobushige ; et al.	2006-04-20
Alignment apparatus, exposure apparatus, and device manufacturing method App 20060028310 - Asano; Toshiya ; et al.	2006-02-09
Stage Apparatus Which Supports Interferometer, Stage Position Measurement Method, Projection Exposure Apparatus, Projection Exposure Apparatus Maintenance Method, Semiconductor Device Manufacturing Method, And Semiconductor Manufacturing Factory Grant 6,867,849 - Iwamoto , et al. March 15, 2	2005-03-15
Linear motor, moving stage system, exposure apparatus, and device manufacturing method App 20040207271 - Korenaga, Nobushige ; et al.	2004-10-21
Alignment apparatus, exposure apparatus, and device manufacturing method App 20040112164 - Asano, Toshiya ; et al.	2004-06-17
Stage apparatus, exposure apparatus, and device production method Grant 6,654,098 - Asano , et al. November 25, 2	2003-11-25
Stage control apparatus and exposure apparatus Grant 6,495,847 - Asano , et al. December 17, 2	2002-12-17
Stage apparatus which supports interferometer, stage position measurement method, projection exposure apparatus, projection exposure apparatus maintenance method, semiconductor device manufacturing method, and semiconductor manufacturing factory App 20020008877 - Iwamoto, Kazunori ; et al.	2002-01-24
Stage apparatus, exposure apparatus, and device production method App 20010015799 - Asano, Toshiya ; et al.	2001-08-23
Integrated circuit package in which impendance between signal pads and signal lines is matched by reducing the size of a ground plane Grant 5,331,204 - Kuroda , et al. July 19, 1	1994-07-19

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