ASANO; Kouji

Patent Applications and Registrations

Patent applications and USPTO patent grants for ASANO; Kouji.The latest application filed is for "embryonic erythroblast-containing cell population and method for producing same, cell culture composition, and compound test method".

Company Profile

0.15.18

ASANO; Kouji - Osaka-shi Osaka
ASANO; Kouji - Kariya-city JP
Asano; Kouji - Toyama JP
Asano; Kouji - Toyama-shi Toyama
Asano; Kouji - Ogaki-shi JP
Asano; Kouji - Ogaki JP
Asano; Kouji - Ogakishi JP
Asano; Kouji - Tokyo JP
Asano; Kouji - Glfu-ken JP
Asano; Kouji - Gifu-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Embryonic Erythroblast-containing Cell Population And Method For Producing Same, Cell Culture Composition, And Compound Test Method App 20220049220 - ASANO; Kouji	2022-02-17
Pressure Sensor App 20220042868 - KODAMA; Hiroshi ; et al.	2022-02-10
Method For Producing Artificial Syncytiotrophoblast And Progenitor Cell Thereof App 20180135022 - ASANO; Kouji ; et al.	2018-05-17
Optical fiber cable and sensor Grant 9,817,200 - Kimura , et al. November 14, 2	2017-11-14
Optical Fiber Cable and Sensor App 20160334595 - Kimura; Tsuyoshi ; et al.	2016-11-17
Optical fiber cable Grant 9,453,980 - Kimura , et al. September 27, 2	2016-09-27
Optical fiber cable App 20160054532 - KIMURA; Tsuyoshi ; et al.	2016-02-25
Plastic optical fiber cable Grant 9,075,213 - Kimura , et al. July 7, 2	2015-07-07
Plastic Optical Fiber Cable App 20140341518 - Kimura; Tsuyoshi ; et al.	2014-11-20
Composition For Jacketing Optical Fiber And Optical Fiber Cable App 20140133812 - Kimura; Tsuyoshi ; et al.	2014-05-15
Multilayered Printed Circuit Board And Manufacturing Method Thereof App 20120125680 - Hirose; Naohiro ; et al.	2012-05-24
Multilayered printed circuit board and manufacturing method thereof Grant 8,148,643 - Hirose , et al. April 3, 2	2012-04-03
Method of manufacturing a multilayered printed circuit board Grant 7,832,098 - Hirose , et al. November 16, 2	2010-11-16
Method of manufacturing multilayered circuit board Grant 7,415,761 - Hirose , et al. August 26, 2	2008-08-26
Multilayered Printed Circuit Board And Manufacturing Method Thereof App 20080189943 - HIROSE; Naohiro ; et al.	2008-08-14
Multilayered Printed Circuit Board And Manufacturing Method Thereof App 20080173473 - HIROSE; Naohiro ; et al.	2008-07-24
Deflector, method of manufacturing deflector, and charged particle beam exposure apparatus Grant 7,276,707 - Iwasaki , et al. October 2, 2	2007-10-02
Printed wiring board and manufacturing method therefor Grant 7,222,776 - Ishida , et al. May 29, 2	2007-05-29
Deflector, method of manufacturing deflector, and charged particle beam exposure apparatus App 20050263713 - Iwasaki, Yuichi ; et al.	2005-12-01
Deflector, method of manufacturing deflector, and charged particle beam exposure apparatus Grant 6,953,938 - Iwasaki , et al. October 11, 2	2005-10-11
Deflector, method of manufacturing deflector, and charged particle beam exposure apparatus App 20050035300 - Iwasaki, Yuichi ; et al.	2005-02-17
Printed wiring board and manufacturing method therefor App 20050023034 - Ishida, Naoto ; et al.	2005-02-03
Array structure and method of manufacturing the same, charged particle beam exposure apparatus, and device manufacturing method Grant 6,818,911 - Tamamori , et al. November 16, 2	2004-11-16
Printed wiring board and manufacturing method therefor Grant 6,784,374 - Ishida , et al. August 31, 2	2004-08-31
Multilayered printed circuit board and manufacturing method therefor App 20040025333 - Hirose, Naohiro ; et al.	2004-02-12
Array structure and method of manufacturing the same, charged particle beam exposure apparatus, and device manufacturing method App 20030218140 - Tamamori, Kenji ; et al.	2003-11-27
Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating Grant 6,591,495 - Hirose , et al. July 15, 2	2003-07-15
Printed wiring board and manufacturing method therefor App 20020182903 - Ishida, Naoto ; et al.	2002-12-05
Multilayer printed wiring board and method for manufacturing the same Grant 6,455,783 - Tsukada , et al. September 24, 2	2002-09-24
Printed wiring board with joining pin and manufacturing method therefor Grant 6,444,924 - Ishida , et al. September 3, 2	2002-09-03
Multilayered printed circuit board and manufacturing method therefor App 20010042637 - Hirose, Naohiro ; et al.	2001-11-22

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