Asano; Eiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Asano; Eiichi.The latest application filed is for "semiconductor encapsulating epoxy resin composition and semiconductor device".

Company Profile

0.16.13

Asano; Eiichi - Annaka JP
Asano; Eiichi - Gunma-ken JP
Asano; Eiichi - Annaka-shi JP
Asano; Eiichi - Usui-gun JP
Asano; Eiichi - Kanagawa JP
Asano; Eiichi - Niigata JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor encapsulating epoxy resin composition and semiconductor device Grant 8,048,969 - Osada , et al. November 1, 2	2011-11-01
Semiconductor encapsulating epoxy resin composition and semiconductor device Grant 7,943,706 - Kimura , et al. May 17, 2	2011-05-17
Semiconductor encapsulating epoxy resin composition and semiconductor device Grant 7,432,603 - Asano , et al. October 7, 2	2008-10-07
Semiconductor encapsulating epoxy resin composition and semiconductor device App 20070207322 - Kimura; Yasuo ; et al.	2007-09-06
Semiconductor encapsulating epoxy resin composition and semiconductor device App 20070106036 - Asano; Eiichi ; et al.	2007-05-10
Semiconductor encapsulating epoxy resin composition and semiconductor device App 20060241250 - Osada; Shoichi ; et al.	2006-10-26
Semiconductor encapsulating epoxy resin composition and semiconductor device App 20060241215 - Osada; Shoichi ; et al.	2006-10-26
Semiconductor encapsulating epoxy resin composition and semiconductor device App 20060216519 - Kimura; Yasuo ; et al.	2006-09-28
Semiconductor encapsulating epoxy resin composition and semiconductor device Grant 7,095,125 - Osada , et al. August 22, 2	2006-08-22
Semiconductor encapsulating epoxy resin composition and semiconductor device App 20050267236 - Asano, Eiichi ; et al.	2005-12-01
Semiconductor encapsulating epoxy resin composition and semiconductor device Grant 6,894,091 - Osada , et al. May 17, 2	2005-05-17
Flip-chip type semiconductor device Grant 6,794,058 - Honda , et al. September 21, 2	2004-09-21
Semiconductor encapsulating epoxy resin composition and semiconductor device Grant 6,723,452 - Kimura , et al. April 20, 2	2004-04-20
Semiconductor encapsulating epoxy resin composition and semiconductor device App 20040034161 - Osada, Shoichi ; et al.	2004-02-19
Semiconductor encapsulating epoxy resin composition and semiconductor device Grant 6,630,745 - Osada , et al. October 7, 2	2003-10-07
Light-transmissive epoxy resin composition and semiconductor device Grant 6,627,328 - Kanamaru , et al. September 30, 2	2003-09-30
Flip-chip type semiconductor device App 20030144382 - Honda, Tsuyoshi ; et al.	2003-07-31
Semiconductor encapsulating epoxy resin composition and semiconductor device App 20030050399 - Kimura, Yasuo ; et al.	2003-03-13
Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith App 20020102429 - Asano, Eiichi ; et al.	2002-08-01
Light-transmissive epoxy resin composition and semiconductor device App 20020058145 - Kanamaru, Tatsuya ; et al.	2002-05-16
Light-transmissive epoxy resin composition and flip-chip type semiconductor device App 20020058742 - Honda, Tsuyoshi ; et al.	2002-05-16
Semiconductor encapsulating epoxy resin composition and semiconductor device App 20020016398 - Osada, Shoichi ; et al.	2002-02-07
Semiconductor encapsulating epoxy resin composition and semiconductor device Grant 6,291,556 - Osada , et al. September 18, 2	2001-09-18
Semiconductor encapsulating epoxy resin composition and semiconductor device Grant 6,168,872 - Ohashi , et al. January 2, 2	2001-01-02
Semiconductor encapsulating epoxy resin composition and semiconductor device Grant 6,162,878 - Osada , et al. December 19, 2	2000-12-19
Encapsulant of crystalline epoxy resin and phenolic resin-crystalline epoxy resin reaction product Grant 6,027,812 - Shiobara , et al. February 22, 2	2000-02-22
Epoxy resin composition Grant 6,001,901 - Shiobara , et al. December 14, 1	1999-12-14
Method of evaluating a semiconductor wafer Grant 5,897,327 - Asano , et al. April 27, 1	1999-04-27
High transparency silica-titania glass beads, method for making, and light transmission epoxy resin compositions Grant 5,175,199 - Asano , et al. December 29, 1	1992-12-29

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