Asako; Yoshinobu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Asako; Yoshinobu.The latest application filed is for "organic semiconductor element, method of manufacturing organic semiconductor element, electronic device, electronic equipment and insulating layer forming composition".

Company Profile

0.11.9

Asako; Yoshinobu - Suita N/A JP
Asako; Yoshinobu - Suita-shi JP
Asako; Yoshinobu - Hyogo JP
Asako; Yoshinobu - Amagasaki JP
Asako; Yoshinobu - Nishinomiya-shi JP
Asako, Yoshinobu - Amagasaki-shi JP
Asako; Yoshinobu - Tsuchiura JP
Asako, Yoshinobu - Tsuchiura-shi JP
Asako, Yoshinobu - Ibaraki JP
Asako; Yoshinobu - Ibaraki-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Organic semiconductor element, method of manufacturing organic semiconductor element, electronic device, electronic equipment and insulating layer forming composition Grant 8,698,142 - Yasuda , et al. April 15, 2	2014-04-15
Organic Semiconductor Element, Method Of Manufacturing Organic Semiconductor Element, Electronic Device, Electronic Equipment And Insulating Layer Forming Composition App 20110175092 - Yasuda; Takuro ; et al.	2011-07-21
Transparent resin material Grant 7,678,881 - Nishichi , et al. March 16, 2	2010-03-16
Resin composition for composite dielectric material, composite dielectric material and electric circuit board using the same Grant 7,632,884 - Yamasaki , et al. December 15, 2	2009-12-15
Fluorine-containing compound Grant 7,589,228 - Nishichi , et al. September 15, 2	2009-09-15
Resin Composition for Optical Packaging Material and Process for Preparing the Same, and Optical Packaging Material, Optical Packaging Component, and Optical Module App 20090010603 - Sugioka; Takuo ; et al.	2009-01-08
Method and apparatus for production of fluorine-containing polyimide film Grant 7,364,771 - Tajiri , et al. April 29, 2	2008-04-29
Transparent Resin Material App 20050282996 - Nishichi, Ai ; et al.	2005-12-22
Fluorine-containing Compound App 20050265686 - Nishichi, Ai ; et al.	2005-12-01
Resin composition for composite dielectric material, composite dielectric material and electric circuit board using ths same App 20050101714 - Yamasaki, Hayahide ; et al.	2005-05-12
Method for deaerating electrorheological fluid in a closed device Grant 6,837,919 - Asako , et al. January 4, 2	2005-01-04
Method and apparatus for production of fluorine-containing polyimide film App 20040234686 - Tajiri, Kozo ; et al.	2004-11-25
Method for deaerating electrorheological fluid in a closed device App 20030024392 - Asako, Yoshinobu ; et al.	2003-02-06
Method for production of halogen-containing aromatic compound App 20010045350 - Teshima, Seiichi ; et al.	2001-11-29
Process for production of 1,4-bis (difluoroalkyl) benzene derivative App 20010002425 - Teshima, Seiichi ; et al.	2001-05-31
Water-soluble electrically-conductive polyaniline and method for production thereof and antistatic agent using water-soluble electrically-conductive polymer Grant 5,993,694 - Ito , et al. November 30, 1	1999-11-30
Carbon black graft polymer, method for production thereof, and use thereof Grant 5,952,429 - Ikeda , et al. September 14, 1	1999-09-14
Electrorheological fluid with improved properties comprising composite polymer Grant 5,558,803 - Okada , et al. September 24, 1	1996-09-24
Electrorheological fluids Grant 5,326,489 - Asako , et al. July 5, 1	1994-07-05

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