Asai; Yasutomi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Asai; Yasutomi.The latest application filed is for "semiconductor device".

Company Profile

0.10.9

Asai; Yasutomi - Kariya JP
ASAI; Yasutomi - Kariya-city JP
Asai; Yasutomi - Okazaki JP
ASAI; Yasutomi - Okazaki-city JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device Grant 10,002,841 - Miyawaki , et al. June 19, 2	2018-06-19
Semiconductor Device App 20170256510 - MIYAWAKI; Shotaro ; et al.	2017-09-07
Semiconductor device with resin mold Grant 9,087,924 - Yamagishi , et al. July 21, 2	2015-07-21
Semiconductor Device And Method For Manufacturing The Same App 20140217620 - YAMAGISHI; Tetsuto ; et al.	2014-08-07
Semiconductor device with resin mold Grant 8,749,055 - Yamagishi , et al. June 10, 2	2014-06-10
Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate Grant 8,446,003 - Komura , et al. May 21, 2	2013-05-21
Method for manufacturing semiconductor device including semiconductor elements with electrode formed thereon Grant 8,309,434 - Asai , et al. November 13, 2	2012-11-13
Semiconductor Device And Method For Manufacturing The Same App 20120223444 - YAMAGISHI; Tetsuto ; et al.	2012-09-06
Semiconductor device with resin mold Grant 8,207,607 - Yamagishi , et al. June 26, 2	2012-06-26
Semiconductor device and method for manufacturing the same App 20110033975 - Asai; Yasutomi ; et al.	2011-02-10
Semiconductor Device App 20100295170 - KOMURA; Atsushi ; et al.	2010-11-25
Semiconductor device and method for manufacturing the same App 20090152714 - Yamagishi; Tetsuto ; et al.	2009-06-18
Semiconductor device and method for manufacturing the same App 20070278550 - Asai; Yasutomi ; et al.	2007-12-06
Semiconductor device having metallic lead and electronic device having lead frame App 20070075419 - Fukuda; Yutaka ; et al.	2007-04-05
Electrical device having metal pad bonded with metal wiring and manufacturing method thereof Grant 6,645,606 - Nakano , et al. November 11, 2	2003-11-11
Electrical device having metal pad bonded with metal wiring and manufacturing method thereof App 20020187319 - Nakano, Tetsuo ; et al.	2002-12-12
Mounting structure of semiconductor element Grant 6,376,906 - Asai , et al. April 23, 2	2002-04-23

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