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Patent applications and USPTO patent grants for Asai; Kazumasa.The latest application filed is for "method for conditioning polishing pad and polishing apparatus".
Patent | Date |
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Method for conditioning polishing pad and polishing apparatus Grant 10,730,161 - Yasuda , et al. | 2020-08-04 |
Method For Conditioning Polishing Pad And Polishing Apparatus App 20180264618 - YASUDA; Taichi ;   et al. | 2018-09-20 |
Double-side polishing method Grant 9,987,721 - Sasaki , et al. June 5, 2 | 2018-06-05 |
Double-side polishing method Grant 9,862,072 - Asai January 9, 2 | 2018-01-09 |
Double-side polishing apparatus Grant 9,108,289 - Furukawa , et al. August 18, 2 | 2015-08-18 |
Double-side Polishing Method App 20150217425 - Sasaki; Masanao ;   et al. | 2015-08-06 |
Double-side Polishing Method App 20150209931 - Asai; Kazumasa | 2015-07-30 |
Double-side Polishing Apparatus App 20150031271 - FURUKAWA; Daisuke ;   et al. | 2015-01-29 |
Wafer polishing method and double-side polishing apparatus Grant 8,834,230 - Furukawa , et al. September 16, 2 | 2014-09-16 |
Wafer Polishing Method And Double-side Polishing Apparatus App 20110130073 - Furukawa; Daisuke ;   et al. | 2011-06-02 |
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