loadpatents
name:-0.0851731300354
name:-0.054447889328003
name:-0.0048670768737793
ASAHI; Toshiyuki Patent Filings

ASAHI; Toshiyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for ASAHI; Toshiyuki.The latest application filed is for "leakage transformer".

Company Profile
4.47.57
  • ASAHI; Toshiyuki - Osaka JP
  • Asahi; Toshiyuki - Hirakata JP
  • Asahi; Toshiyuki - Tokyo JP
  • Asahi; Toshiyuki - Hirakata-shi JP
  • Asahi; Toshiyuki - Osaka-shi JP
  • Asahi; Toshiyuki - Hyogo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Leakage Transformer
App 20220189687 - KOTANI; Junichi ;   et al.
2022-06-16
Reactor And Electric Power Conversion Device
App 20220130588 - ASAHI; TOSHIYUKI ;   et al.
2022-04-28
Reactor
App 20220108830 - ASAHI; TOSHIYUKI ;   et al.
2022-04-07
Reactor, Core Member, And Power Supply Circuit
App 20200365311 - ASAHI; Toshiyuki ;   et al.
2020-11-19
Reactor
Grant 10,607,763 - Matsutani , et al.
2020-03-31
Coil Part
App 20190066897 - KOTANI; Junichi ;   et al.
2019-02-28
Reactor
App 20180174733 - MATSUTANI; NOBUYA ;   et al.
2018-06-21
Reactor
App 20180040408 - KOTANI; JUNICHI ;   et al.
2018-02-08
Prepreg, laminate, metal foil-clad laminate, circuit board and LED module
Grant 9,730,320 - Matsuda , et al. August 8, 2
2017-08-08
Printed wiring board, build-up multi-layer board, and production method therefor
Grant 8,866,022 - Kitagawa , et al. October 21, 2
2014-10-21
Wiring Board And Light Emitting Device Using Same, And Manufacturing Method For Both
App 20140225152 - ASAHI; Toshiyuki ;   et al.
2014-08-14
Prepreg, laminate, metal clad laminate, circuit board, and circuit board for LED mounting
Grant 8,603,624 - Matsuda , et al. December 10, 2
2013-12-10
Prepreg, Laminate, Metal Foil-clad Laminate, Circuit Board And Led Module
App 20130215628 - Matsuda; Takashi ;   et al.
2013-08-22
Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition
Grant 8,465,666 - Asahi , et al. June 18, 2
2013-06-18
Prepreg, Laminate, Metal-foil-clad Laminate, Circuit Board, And Circuit Board For Led Mounting
App 20120228010 - Matsuda; Takashi ;   et al.
2012-09-13
Printed Wiring Board, Build-up Multi-layer Board, And Production Method Therefor
App 20120152599 - Kitagawa; Yoshito ;   et al.
2012-06-21
Thermoconductive Composition, Heat Dissipating Plate, Heat Dissipating Substrate And Circuit Module Using Thermoconductive Composition, And Process For Production Of Thermoconductive Composition
App 20120025132 - Asahi; Toshiyuki ;   et al.
2012-02-02
Module with a built-in component, and electronic device with the same
Grant 8,064,213 - Asahi , et al. November 22, 2
2011-11-22
Passive component incorporating interposer
Grant 7,968,800 - Sasaoka , et al. June 28, 2
2011-06-28
Usability Evaluation Apparatus, Usability Evaluation Method, And Program
App 20110125803 - Asahi; Toshiyuki
2011-05-26
Transfer material used for producing a wiring substrate
Grant 7,888,789 - Sugaya , et al. February 15, 2
2011-02-15
Multilayer wiring board
Grant 7,821,795 - Sugaya , et al. October 26, 2
2010-10-26
Wiring Board
App 20100230138 - Asahi; Toshiyuki ;   et al.
2010-09-16
Method for producing connection member
Grant 7,748,110 - Asahi , et al. July 6, 2
2010-07-06
Passive Component Incorporating Interposer
App 20100155119 - Sasaoka; Tatsuo ;   et al.
2010-06-24
Mounting board, mounted body, and electronic equipment using the same
Grant 7,667,977 - Sugaya , et al. February 23, 2
2010-02-23
Mounting Board, Mounted Body, and Electronic Equipment Using the Same
App 20080290497 - Sugaya; Yasuhiro ;   et al.
2008-11-27
Mobile terminal, circuit board, circuit board design aiding apparatus and method, design aiding program, and storage medium having stored therein design aiding program
Grant 7,418,603 - Nakayama , et al. August 26, 2
2008-08-26
Electronic component built-in module and method of manufacturing the same
Grant 7,394,663 - Yamashita , et al. July 1, 2
2008-07-01
Semiconductor device and method for manufacturing the same
Grant 7,390,692 - Sugaya , et al. June 24, 2
2008-06-24
Circuit board with built-in electronic component and method for manufacturing the same
Grant 7,341,890 - Ishimaru , et al. March 11, 2
2008-03-11
Connection member and mount assembly and production method of the same
App 20080047137 - Asahi; Toshiyuki ;   et al.
2008-02-28
Component built-in module and method for producing the same
Grant 7,294,587 - Asahi , et al. November 13, 2
2007-11-13
Multilayer Wiring Board, Method for Manufacturing Such Multilayer Wiring Board, and Semiconductor Device and Electronic Device Using Multilayer Wiring Board
App 20070242440 - Sugaya; Yasuhiro ;   et al.
2007-10-18
Optical Transmission Channel Board, Board With Built-in Optical Transmission Channel, And Data Processing Apparatus
App 20070224735 - Karashima; Seiji ;   et al.
2007-09-27
Connection member and mount assembly and production method of the same
Grant 7,258,549 - Asahi , et al. August 21, 2
2007-08-21
Module with built-in circuit component and method for producing the same
Grant 7,248,482 - Asahi , et al. July 24, 2
2007-07-24
Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatus
Grant 7,242,823 - Karashima , et al. July 10, 2
2007-07-10
Printed wiring board
App 20070137890 - Tagi; Hiroyoshi ;   et al.
2007-06-21
Component built-in module and method for producing the same
Grant 7,198,996 - Nakatani , et al. April 3, 2
2007-04-03
Wiring board embedded with spherical semiconductor element
App 20070069393 - Asahi; Toshiyuki ;   et al.
2007-03-29
Circuit component built-in module and method for manufacturing the same
Grant 7,180,169 - Ishimaru , et al. February 20, 2
2007-02-20
Semiconductor device and method for manufacturing the same
App 20060290009 - Sugaya; Yasuhiro ;   et al.
2006-12-28
Mount assembly, optical transmission line and photoelectric circuit board
Grant 7,136,543 - Nishiyama , et al. November 14, 2
2006-11-14
Semiconductor device and method for manufacturing the same
Grant 7,132,756 - Sugaya , et al. November 7, 2
2006-11-07
Circuit board with built-in electronic component and method for manufacturing the same
App 20060244119 - Ishimaru; Yukihiro ;   et al.
2006-11-02
Circuit board with built-in electronic component and method for manufacturing the same
Grant 7,091,593 - Ishimaru , et al. August 15, 2
2006-08-15
Semiconductor built-in millimeter-wave band module
Grant 7,061,100 - Iwaki , et al. June 13, 2
2006-06-13
Circuit component built-in module with embedded semiconductor chip and method of manufacturing
Grant 7,018,866 - Sugaya , et al. March 28, 2
2006-03-28
Component built-in module and method for producing the same
Grant 6,975,516 - Asahi , et al. December 13, 2
2005-12-13
Component built-in module and method for producing the same
App 20050269681 - Asahi, Toshiyuki ;   et al.
2005-12-08
Component built-in module and method for producing the same
App 20050230848 - Nakatani, Seiichi ;   et al.
2005-10-20
Method of manufacturing a component built-in module
Grant 6,955,948 - Asahi , et al. October 18, 2
2005-10-18
Fabrication method for optical transmission channel board, optical transmission channel board, board with built-in optical transmission channel, fabrication method for board with built-in optical transmission channel, and data processing apparatus
App 20050196095 - Karashima, Seiji ;   et al.
2005-09-08
Component built-in module and method for producing the same
Grant 6,939,738 - Nakatani , et al. September 6, 2
2005-09-06
Wiring substrate produced by transfer material method
Grant 6,936,774 - Sugaya , et al. August 30, 2
2005-08-30
Three-dimensional mounting structure and method for producing the same
App 20050184372 - Asahi, Toshiyuki ;   et al.
2005-08-25
Wiring substrate produced by transfer material method
App 20050186768 - Sugaya, Yasuhiro ;   et al.
2005-08-25
Connection member and mount assembly and production method of the same
App 20050184381 - Asahi, Toshiyuki ;   et al.
2005-08-25
Circuit component built-in module, radio device having the same, and method for producing the same
Grant 6,931,725 - Sugaya , et al. August 23, 2
2005-08-23
Module with a built-in component, and electronic device with the same
App 20050168960 - Asahi, Toshiyuki ;   et al.
2005-08-04
Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling member of the module
Grant 6,885,788 - Iwaki , et al. April 26, 2
2005-04-26
Mobile terminal, circuit board, circuit board design aiding apparatus and method, design aiding program, and storage medium having stored therein design aiding program
App 20050081049 - Nakayama, Takeshi ;   et al.
2005-04-14
Transfer material for wiring substrate
Grant 6,871,396 - Sugaya , et al. March 29, 2
2005-03-29
Circuit component built-in module and method for manufacturing the same
App 20050045369 - Ishimaru, Yukihiro ;   et al.
2005-03-03
Insulation sheet, multi-layer wiring substrate and production processes thereof
Grant 6,855,892 - Komatsu , et al. February 15, 2
2005-02-15
Circuit board with in-built electronic component and method for manufacturing the same
App 20050006142 - Ishimaru, Yukihiro ;   et al.
2005-01-13
Mount assembly, optical transmission line and photoelectric circuit board
App 20050002608 - Nishiyama, Tousaku ;   et al.
2005-01-06
Module with built-in circuit component and method for producing the same
App 20040226744 - Asahi, Toshiyuki ;   et al.
2004-11-18
Piezoelectric transformer, piezoelectric transformer drive circuit, piezoelectric transformer drive method and cold cathode tube drive apparatus using piezoelectric transformer
Grant 6,794,796 - Nakatsuka , et al. September 21, 2
2004-09-21
Circuit component built-in module with embedded semiconductor chip and method of manufacturing
Grant 6,784,530 - Sugaya , et al. August 31, 2
2004-08-31
Component built-in module and method for producing the same
App 20040158980 - Nakatani, Seiichi ;   et al.
2004-08-19
Electronic component built-in module and method of manufacturing the same
App 20040160752 - Yamashita, Yoshihisa ;   et al.
2004-08-19
Circuit component built-in module with embedded semiconductor chip and method of manufacturing
App 20040145044 - Sugaya, Yasuhiro ;   et al.
2004-07-29
Piezoelectric transformer, piezoelectric transformer drive circuit, piezoelectric transformer drive method and cold cathode tube drive apparatus using piezoelectric transformer
Grant 6,737,816 - Nakatsuka , et al. May 18, 2
2004-05-18
Component built-in module and method for producing the same
Grant 6,734,542 - Nakatani , et al. May 11, 2
2004-05-11
Semiconductor device and method for manufacturing the same
App 20040084769 - Sugaya, Yasuhiro ;   et al.
2004-05-06
Printed wiring board
App 20040012935 - Tagi, Hiroyoshi ;   et al.
2004-01-22
Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling of member the module
App 20040001661 - Iwaki, Hideki ;   et al.
2004-01-01
Semiconductor built -in millimeter-wave band module
App 20030189246 - Iwaki, Hideki ;   et al.
2003-10-09
Circuit component built-in module, radio device having the same, and method for producing the same
App 20030141105 - Sugaya, Yasuhiro ;   et al.
2003-07-31
Circuit component built-in module and method of manufacturing the same
App 20030137045 - Sugaya, Yasuhiro ;   et al.
2003-07-24
Metal wiring board, semiconductor device, and method for manufacturing the same
App 20030127725 - Sugaya, Yasuhiro ;   et al.
2003-07-10
Transfer material method for producing the same and wiring substrate produced by using the same
App 20030102153 - Sugaya, Yasuhiro ;   et al.
2003-06-05
Piezoelectric transformer, piezoelectric transformer drive circuit, piezoelectric transformer drive method and cold cathode tube drive apparatus using piezoelectric transformer
App 20030102780 - Nakatsuka, Hiroshi ;   et al.
2003-06-05
Component built-in module and method for producing the same
App 20030090883 - Asahi, Toshiyuki ;   et al.
2003-05-15
Insulation sheet and multi-layer wiring substrate and production processes thereof
App 20030085058 - Komatsu, Shingo ;   et al.
2003-05-08
Component built-in module and method of manufacturing the same
App 20030062624 - Asahi, Toshiyuki ;   et al.
2003-04-03
Circuit component built-in module, radio device having the same, and method for producing the same
Grant 6,538,210 - Sugaya , et al. March 25, 2
2003-03-25
Component built-in module and method of manufacturing the same
Grant 6,489,685 - Asahi , et al. December 3, 2
2002-12-03
Component built-in module and method of manufacturing the same
App 20020135058 - Asahi, Toshiyuki ;   et al.
2002-09-26
Component built-in module and method for producing the same
App 20020117743 - Nakatani, Seiichi ;   et al.
2002-08-29
Method and unit for driving piezoelectric transformer used for controlling luminance of cold-cathode tube
Grant 6,433,458 - Nakatsuka , et al. August 13, 2
2002-08-13
Magnetic element and method of manufacturing the same
Grant 6,392,525 - Kato , et al. May 21, 2
2002-05-21
Piezoelectric transformer, piezoelectric transformer drive circuit, piezoelectric transformer drive method and cold cathode tube drive apparatus using piezoelectric transformer
App 20020011764 - Nakatsuka, Hiroshi ;   et al.
2002-01-31
Method and unit for driving piezoelectric transformer used for controlling luminance of cold-cathode tube
App 20010035698 - Nakatsuka, Hiroshi ;   et al.
2001-11-01
Circuit component built-in module, radio device having the same, and method for producing the same
App 20010030059 - Sugaya, Yasuhiro ;   et al.
2001-10-18
Transfer material, method for producing the same and wiring substrate produced by using the same
App 20010023779 - Sugaya, Yasuhiro ;   et al.
2001-09-27
Method and apparatus for recording and analyzing an interaction log
Grant 5,793,948 - Asahi , et al. August 11, 1
1998-08-11

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