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Package having very thin semiconductor chip, multichip module assembled by the package, and method for manufacturing the same Grant 6,413,798 - Asada July 2, 2 | 2002-07-02 |
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Package having very thin semiconductor chip, multichip module assembled by the package, and method for manufacturing the same App 20010012643 - Asada, Junichi | 2001-08-09 |
Package having very thin semiconductor chip, multichip module assembled by the package, and method for manufacturing the same Grant 6,239,496 - Asada May 29, 2 | 2001-05-29 |
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Twisted nematic polarizing element with a concentric circle orientation surface and optical head device incorporating the same Grant 5,142,394 - Asada , et al. August 25, 1 | 1992-08-25 |
Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member Grant 5,091,341 - Asada , et al. February 25, 1 | 1992-02-25 |