Arvin; Charles Leon
Patent Applications and Registrations
Patent applications and USPTO patent grants for Arvin; Charles Leon.The latest application filed is for "near tier decoupling capacitors".
- Arvin; Charles Leon - Poughkeepsie NY
| Patent | Date |
|---|---|
| Near Tier Decoupling Capacitors App 20220271005 - Arvin; Charles Leon ; et al. | 2022-08-25 |
| Enlarged conductive pad structures for enhanced chip bond assembly yield Grant 11,282,773 - Tunga , et al. March 22, 2 | 2022-03-22 |
| High Bandwidth Module App 20220059499 - Arvin; Charles Leon ; et al. | 2022-02-24 |
| Mitigating thermal-mechanical strain and warpage of an organic laminate substrate Grant 11,239,183 - Sinha , et al. February 1, 2 | 2022-02-01 |
| High bandwidth module Grant 11,201,136 - Arvin , et al. December 14, 2 | 2021-12-14 |
| Deionized-water cooling for electrical equipment Grant 11,180,398 - Singh , et al. November 23, 2 | 2021-11-23 |
| Localized catalyst for enhanced thermal interface material heat transfer Grant 11,152,282 - Arvin , et al. October 19, 2 | 2021-10-19 |
| Enlarged Conductive Pad Structures For Enhanced Chip Bond Assembly Yield App 20210320056 - Tunga; Krishna R. ; et al. | 2021-10-14 |
| High Bandwidth Module App 20210288025 - Arvin; Charles Leon ; et al. | 2021-09-16 |
| Flip chip packaging rework Grant 11,121,101 - Arvin , et al. September 14, 2 | 2021-09-14 |
| Flip Chip Packaging Rework App 20210242146 - Arvin; Charles Leon ; et al. | 2021-08-05 |
| Mitigating Thermal-mechanical Strain And Warpage Of An Organic Laminate Substrate App 20210242139 - Sinha; Tuhin ; et al. | 2021-08-05 |
| Fins for enhanced die communication Grant 11,031,343 - Arvin , et al. June 8, 2 | 2021-06-08 |
| Computer system with modified module socket Grant 10,993,324 - Arvin , et al. April 27, 2 | 2021-04-27 |
| Computer System With Modified Module Socket App 20200412045 - Arvin; Charles Leon ; et al. | 2020-12-31 |
| Fins For Enhanced Die Communication App 20200402912 - Arvin; Charles Leon ; et al. | 2020-12-24 |
| Deionized-water Cooling For Electrical Equipment App 20200392026 - Singh; Prabjit ; et al. | 2020-12-17 |
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