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name:-0.0022587776184082
name:-0.00041699409484863
Arunachalam; Valli Patent Filings

Arunachalam; Valli

Patent Applications and Registrations

Patent applications and USPTO patent grants for Arunachalam; Valli.The latest application filed is for "integrated circuits and methods for fabricating integrated circuits with silicide contacts on non-planar structures".

Company Profile
0.4.6
  • Arunachalam; Valli - Pleasant Valley NY
  • Arunachalam; Valli - Garland TX
  • Arunachalam, Valli - Austin TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Integrated circuits and methods for fabricating integrated circuits with silicide contacts on non-planar structures
Grant 9,142,633 - Besser , et al. September 22, 2
2015-09-22
Methods for fabricating integrated circuits having low resistance metal gate structures
Grant 8,778,789 - Besser , et al. July 15, 2
2014-07-15
Integrated Circuits And Methods For Fabricating Integrated Circuits With Silicide Contacts On Non-planar Structures
App 20140167264 - Besser; Paul R. ;   et al.
2014-06-19
Methods For Fabricating Integrated Circuits Having Low Resistance Metal Gate Structures
App 20140154877 - Besser; Paul R. ;   et al.
2014-06-05
Methods for fabricating integrated circuits having low resistance device contacts
Grant 8,691,689 - Besser , et al. April 8, 2
2014-04-08
Properties of metallic copper diffusion barriers through silicon surface treatments
Grant 8,211,794 - Arunachalam , et al. July 3, 2
2012-07-03
Scalability With Reduced Contact Resistance
App 20110204518 - Arunachalam; Valli
2011-08-25
MOS TRANSISTORS HAVING NiPtSi CONTACT LAYERS AND METHODS FOR FABRICATING THE SAME
App 20090127594 - ARUNACHALAM; Valli ;   et al.
2009-05-21
Properties Of Metallic Copper Diffusion Barriers Through Silicon Surface Treatments
App 20080290515 - Arunachalam; Valli ;   et al.
2008-11-27
Method for forming magnetic clad bit line
App 20040087163 - Steimle, Robert ;   et al.
2004-05-06

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