loadpatents
name:-0.049746036529541
name:-0.039516925811768
name:-0.0040910243988037
Artmann; Hans Patent Filings

Artmann; Hans

Patent Applications and Registrations

Patent applications and USPTO patent grants for Artmann; Hans.The latest application filed is for "sensor device and method for producing a sensor device".

Company Profile
3.34.41
  • Artmann; Hans - Boeblingen-Dagersheim DE
  • Artmann; Hans - Boeblingen DE
  • Artmann; Hans - Magstadt DE
  • Artmann; Hans - Boblingen DE
  • Artmann; Hans - Boblingen-Dagersheim DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Sensor Device And Method For Producing A Sensor Device
App 20220090975 - Weber; Heribert ;   et al.
2022-03-24
Method For Sealing Entries In A Mems Element
App 20220002147 - Hermes; Christoph ;   et al.
2022-01-06
Micromechanical Component For A Capacitive Pressure Sensor Device
App 20220003621 - Friedrich; Thomas ;   et al.
2022-01-06
Sensor Device And Method For Producing A Sensor Device
App 20210403315 - Artmann; Hans ;   et al.
2021-12-30
Micromechanical Component And Method For Manufacturing A Micromechanical Component
App 20210395074 - Artmann; Hans ;   et al.
2021-12-23
Pivot apparatus for a micromirror, and illumination apparatus having a pivot apparatus for a micromirror
Grant 10,914,937 - Classen , et al. February 9, 2
2021-02-09
Micromechanical Component For A Capacitive Pressure Sensor Device
App 20200200631 - Friedrich; Thomas ;   et al.
2020-06-25
Method for producing a multilayer MEMS component, and corresponding multilayer MEMS component
Grant 10,427,937 - Kaelberer , et al. October 1, 2
2019-10-01
Method For Producing A Multilayer Mems Component, And Corresponding Multilayer Mems Component
App 20190016590 - Kaelberer; Arnd ;   et al.
2019-01-17
Etching device and etching method
Grant 10,020,169 - Kaelberer , et al. July 10, 2
2018-07-10
Method for manufacturing microelectromechanical structures in a layer sequence and a corresponding electronic component having a microelectromechanical structure
Grant 9,932,223 - Artmann , et al. April 3, 2
2018-04-03
Etching Device And Etching Method
App 20170207067 - Kaelberer; Arnd ;   et al.
2017-07-20
Pivot Apparatus For A Micromirror, And Illumination Apparatus Having A Pivot Apparatus For A Micromirror
App 20170059852 - Classen; Johannes ;   et al.
2017-03-02
Method For Manufacturing Microelectromechanical Structures In A Layer Sequence And A Corresponding Electronic Component Having A Microelectromechanical Structure
App 20160304334 - Artmann; Hans ;   et al.
2016-10-20
Comb drive including a pivotable mirror element
Grant 9,372,341 - Artmann , et al. June 21, 2
2016-06-21
Micromechanical component and method for producing a micromechanical component
Grant 9,309,111 - Artmann , et al. April 12, 2
2016-04-12
Micromechanical Component And Method For Producing A Micromechanical Component
App 20150131136 - ARTMANN; Hans ;   et al.
2015-05-14
Method for producing a semiconductor component and a semiconductor component produced according to the method
Grant RE44,995 - Benzel , et al. July 8, 2
2014-07-08
Semiconductor Device And Method For Manufacturing A Semiconductor Device
App 20140151885 - SCHMOLLNGRUBER; Peter ;   et al.
2014-06-05
Method for manufacturing a micromechanical component, and micromechanical component
Grant 8,481,427 - Artmann , et al. July 9, 2
2013-07-09
Layer structure for electrical contacting of semiconductor components
Grant 8,299,549 - Reinmuth , et al. October 30, 2
2012-10-30
Pressure sensor
Grant 8,196,474 - Reinmuth , et al. June 12, 2
2012-06-12
Method for producing a semiconductor component and a semiconductor component produced according to the method
Grant 8,123,963 - Benzel , et al. February 28, 2
2012-02-28
Micromechanical component and method for producing a micromechanical component
Grant 8,076,739 - Schmollngruber , et al. December 13, 2
2011-12-13
Sensor element for capacitive differential-pressure sensing
Grant 7,992,443 - Opitz , et al. August 9, 2
2011-08-09
Layer Structure For Electrical Contacting Of Semiconductor Components
App 20110127674 - Reinmuth; Jochen ;   et al.
2011-06-02
Pressure sensor
App 20110048137 - REINMUTH; Jochen ;   et al.
2011-03-03
Micromechanical component and corresponding production method
Grant 7,833,405 - Benzel , et al. November 16, 2
2010-11-16
Method for Manufacturing a Micromechanical Component, and Micromechanical Component
App 20100260974 - Artmann; Hans ;   et al.
2010-10-14
Micromechanical Component And Method For Producing A Micromechanical Component
App 20100176469 - Schmollngruber; Peter ;   et al.
2010-07-15
Sensor Element For Capacitive Differential-pressure Sensing
App 20100170346 - Opitz; Bernhard ;   et al.
2010-07-08
Structural element having a porous region at least regionally provided with a cover layer and its use as well as method for setting the thermal conductivity of a porous region
Grant 7,709,933 - Artmann , et al. May 4, 2
2010-05-04
Method for manufacturing a semiconductor component and a semiconductor component, in particular a diaphragm sensor
Grant 7,679,154 - Benzel , et al. March 16, 2
2010-03-16
Method for Manufacturing a Diaphragm on a Semiconductor Substrate and Micromechanical Component Having Such a Diaphragm
App 20100025786 - Schmollngruber; Peter ;   et al.
2010-02-04
Micromechanical component having a diaphragm
Grant 7,495,302 - Fischer , et al. February 24, 2
2009-02-24
Method for producing a semiconductor component and a semiconductor component produced according to the method
Grant 7,479,232 - Benzel , et al. January 20, 2
2009-01-20
Method for producing a semiconductor component and a semiconductor component produced according to the method
App 20080286970 - Benzel; Hubert ;   et al.
2008-11-20
Method for manufacturing a semcoductor component and a semiconductor component, in particular a diaphragm sensor
App 20080093694 - Benzel; Hubert ;   et al.
2008-04-24
Method for producing a semiconductor component and a semiconductor component, especially a membrane sensor
Grant 7,306,966 - Benzel , et al. December 11, 2
2007-12-11
Micromechanical component, in particular a sensor element, having a stabilized membrane and a method of producing such a component
Grant 7,276,277 - Artmann , et al. October 2, 2
2007-10-02
Sensor with at least one micromechanical structure, and method for producing it
Grant 7,273,764 - Reichenbach , et al. September 25, 2
2007-09-25
Semiconductor component, particularly a micromechanical pressure sensor
Grant 7,057,248 - Sautter , et al. June 6, 2
2006-06-06
Method for producing micromechanic sensors and sensors produced by said method
Grant 7,045,382 - Benzel , et al. May 16, 2
2006-05-16
Flow sensor
Grant 7,040,160 - Artmann , et al. May 9, 2
2006-05-09
Method for production of a semiconductor component and a semiconductor component produced by said method
Grant 7,037,438 - Benzel , et al. May 2, 2
2006-05-02
Method for producing a semiconductor component and a semiconductor component produced according to the method
App 20060014392 - Benzel; Hubert ;   et al.
2006-01-19
Semiconductor component having a first earlier structure differing from a second earlier structure
Grant 6,972,447 - Benzel , et al. December 6, 2
2005-12-06
Sensor with at least one micromechanical structure, and method for producing it
App 20050230708 - Reichenbach, Frank ;   et al.
2005-10-20
Micromechanical component having a diaphragm, and method for manufacturing such a component
App 20050204821 - Fischer, Frank ;   et al.
2005-09-22
Sensor with at least one micromechanical structure and method for production thereof
Grant 6,936,902 - Reichenbach , et al. August 30, 2
2005-08-30
Micromechanical component
Grant 6,906,392 - Benzel , et al. June 14, 2
2005-06-14
Method for producing a semiconductor component and a semiconductor component, especially a membrane sensor
App 20040266050 - Benzel, Hubert ;   et al.
2004-12-30
Micromechanical component with different doping types so that one type is anodized into porous silicon
Grant 6,803,637 - Benzel , et al. October 12, 2
2004-10-12
Structural element having a porous region and its use as well as method for setting the thermal conductivity of a porous region
App 20040188808 - Artmann, Hans ;   et al.
2004-09-30
Method for producing optically transparent regions in a silicon substrate
App 20040155010 - Benzel, Hubert ;   et al.
2004-08-12
Method for producing micromechanic sensors and sensors produced by said method
App 20040152228 - Benzel, Hubert ;   et al.
2004-08-05
Method for producing diaphragm sensor unit and diaphragm sensor unit
Grant 6,759,265 - Artmann , et al. July 6, 2
2004-07-06
Module, especially a wafer module
App 20040084398 - Breitschwerdt, Klaus ;   et al.
2004-05-06
Micromechanical component and corresponding production method
App 20040080004 - Benzel, Hubert ;   et al.
2004-04-29
Electrochemical etching cell
Grant 6,726,815 - Artmann , et al. April 27, 2
2004-04-27
Flow sensor
App 20040069626 - Artmann, Hans ;   et al.
2004-04-15
Sensor with at least one micromechanical structure and method for production thereof
App 20040065932 - Reichenbach, Frank ;   et al.
2004-04-08
Semiconductor component and method
App 20040048430 - Benzel, Hubert ;   et al.
2004-03-11
Micromechanical component
App 20040021184 - Benzel, Hubert ;   et al.
2004-02-05
Method for manufacturing breakaway layers for detaching deposited layer systems
Grant 6,677,249 - Laermer , et al. January 13, 2
2004-01-13
Integrated detonating or firing element, and use thereof
App 20030183109 - Rudhard, Joachim ;   et al.
2003-10-02
Semiconductor component, particularly a micromechanical pressure sensor
App 20030146447 - Sautter, Helmut ;   et al.
2003-08-07
Method for producing a diaphragm sensor unit and diaphragm sensor unit
App 20030127699 - Artmann, Hans ;   et al.
2003-07-10
Micromechanical component and corresponing production method
App 20030116813 - Benzel, Hubert ;   et al.
2003-06-26
Method for producing diaphragm sensor unit and diaphragm sensor unit
App 20030110867 - Artmann, Hans ;   et al.
2003-06-19
Method for production of a thin film and a thin-film solar cell, in particular, on a carrier substrate
Grant 6,555,443 - Artmann , et al. April 29, 2
2003-04-29
Method for production of a semiconductor component and a semiconductor component produced by said method
App 20020170875 - Benzel, Hubert ;   et al.
2002-11-21
Micromechanical component, in particular a sensor element, having a stabilized membrane and a method of producing such a component
App 20020094435 - Artmann, Hans ;   et al.
2002-07-18
Method For Manufacturing Breakaway Layers For Detaching Deposited Laye
App 20010055881 - LAERMER, FRANZ ;   et al.
2001-12-27

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