loadpatents
name:-0.015174865722656
name:-0.11412811279297
name:-0.0022649765014648
ARRINGTON; Kyle Patent Filings

ARRINGTON; Kyle

Patent Applications and Registrations

Patent applications and USPTO patent grants for ARRINGTON; Kyle.The latest application filed is for "immersion cooling for integrated circuit devices".

Company Profile
1.0.12
  • ARRINGTON; Kyle - Gilbert AZ
  • ARRINGTON; Kyle - Blacksburg VA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Gallium Alloys As Fillers For Polymer Thermal Interface Materials
App 20220199489 - ARRINGTON; Kyle ;   et al.
2022-06-23
Immersion Cooling For Integrated Circuit Devices
App 20220201889 - Sover; Raanan ;   et al.
2022-06-23
Low Force Liquid Metal Interconnect Solutions
App 20210392774 - MEYYAPPAN; Karumbu ;   et al.
2021-12-16
Methods And Apparatus To Provide Electrical Shielding For Integrated Circuit Packages Using A Thermal Interface Material
App 20210327782 - Han; Dong-Ho ;   et al.
2021-10-21
Interposer Heat Spreader
App 20210272885 - ARRINGTON; Kyle ;   et al.
2021-09-02
Enhanced Base Die Heat Path Using Through-silicon Vias
App 20210257277 - BERTRAND; Weston ;   et al.
2021-08-19
Printed Heat Spreader Structures And Methods Of Providing Same
App 20210242105 - Reyes Schuldes; Jesus Gerardo ;   et al.
2021-08-05
First-level Integration Of Second-level Thermal Interface Material For Integrated Circuit Assemblies
App 20210225729 - Bozorg-Grayeli; Elah ;   et al.
2021-07-22
Ic Assemblies Including Die Perimeter Frames Suitable For Containing Thermal Interface Materials
App 20210202348 - Arrington; Kyle ;   et al.
2021-07-01
Full Package Vapor Chamber With Ihs
App 20210195798 - NEAL; Nicholas ;   et al.
2021-06-24
Copolymer Compatibilizers And Uses Thereof
App 20210002406 - MATSON; John ;   et al.
2021-01-07
Integrated Heat Spreader With Enhanced Vapor Chamber For Multichip Packages
App 20200350229 - Chang; Je-Young ;   et al.
2020-11-05

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