Arora; Vivek Kishorechand
Patent Applications and Registrations
Patent applications and USPTO patent grants for Arora; Vivek Kishorechand.The latest application filed is for "semiconductor package with isolated heat spreader".
- Arora; Vivek Kishorechand - San Jose CA
- Arora; Vivek Kishorechand - Mountain View CA
| Patent | Date |
|---|---|
| Semiconductor Package With Isolated Heat Spreader App 20220238424 - Poddar; Anindya ; et al. | 2022-07-28 |
| IC package with half-bridge power module Grant 11,387,179 - Shibuya , et al. July 12, 2 | 2022-07-12 |
| Semiconductor package with isolated heat spreader Grant 11,302,615 - Poddar , et al. April 12, 2 | 2022-04-12 |
| Embedded Die Packaging With Integrated Ceramic Substrate App 20220108955 - Kim; Woochan ; et al. | 2022-04-07 |
| Power Conversion Module App 20220029519 - Kim; Woochan ; et al. | 2022-01-27 |
| Stress buffer layer in embedded package Grant 11,183,441 - Kim , et al. November 23, 2 | 2021-11-23 |
| Embedded die packaging with integrated ceramic substrate Grant 11,183,460 - Kim , et al. November 23, 2 | 2021-11-23 |
| Embedded die package multichip module Grant 11,158,595 - Kim , et al. October 26, 2 | 2021-10-26 |
| Package with stacked power stage and integrated control die Grant 11,158,567 - Kim , et al. October 26, 2 | 2021-10-26 |
| Package Panel Processing With Integrated Ceramic Isolation App 20210280512 - Kim; Woochan ; et al. | 2021-09-09 |
| Semiconductor Package With Isolated Heat Spreader App 20210202357 - Poddar; Anindya ; et al. | 2021-07-01 |
| Ic Package With Half-bridge Power Module App 20210175165 - SHIBUYA; MAKOTO ; et al. | 2021-06-10 |
| Package panel processing with integrated ceramic isolation Grant 11,031,332 - Kim , et al. June 8, 2 | 2021-06-08 |
| Frame Design In Embedded Die Package App 20210134729 - Kim; Woochan ; et al. | 2021-05-06 |
| Power Stage Package Including Flexible Circuit And Stacked Die App 20210111105 - Kim; Woochan ; et al. | 2021-04-15 |
| Package With Stacked Power Stage And Integrated Control Die App 20210043551 - Kim; Woochan ; et al. | 2021-02-11 |
| Electronic device with double-sided cooling Grant 10,879,155 - Kim , et al. December 29, 2 | 2020-12-29 |
| Electronic Device With Double-sided Cooling App 20200357729 - Kim; Woochan ; et al. | 2020-11-12 |
| Package Panel Processing With Integrated Ceramic Isolation App 20200251415 - Kind Code | 2020-08-06 |
| Stress Buffer Layer in Embedded Package App 20200203249 - Kim; Woochan ; et al. | 2020-06-25 |
| Package With Dual Layer Routing Including Ground Return Path App 20200194390 - Kim; Woochan ; et al. | 2020-06-18 |
| High Voltage Flip-Chip On Lead (FOL) Package App 20200161225 - Poddar; Anindya ; et al. | 2020-05-21 |
| High Voltage Flip-chip On Lead (fol) Package App 20200091048 - Poddar; Anindya ; et al. | 2020-03-19 |
| Embedded Die Packaging With Integrated Ceramic Substrate App 20200091076 - Kim; Woochan ; et al. | 2020-03-19 |
| Stress buffer layer in embedded package Grant 10,580,715 - Kim , et al. | 2020-03-03 |
| High voltage flip-chip on lead (FOL) package Grant 10,580,722 - Poddar , et al. | 2020-03-03 |
| Stress Buffer Layer in Embedded Package App 20190385924 - Kim; Woochan ; et al. | 2019-12-19 |
| Integrated Circuit (ic) Packages With Shields And Methods Of Producing The Same App 20190287918 - Kim; Woochan ; et al. | 2019-09-19 |
| Embedded Die Package Multichip Module App 20190013288 - KIM; WOOCHAN ; et al. | 2019-01-10 |
| Encapsulant material applicator for semiconductor wafers and method of use thereof Grant 6,730,170 - Pham , et al. May 4, 2 | 2004-05-04 |
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