ARORA; Hitesh

Patent Applications and Registrations

Patent applications and USPTO patent grants for ARORA; Hitesh.The latest application filed is for "a method of immune modulation by modulating abcf1".

Company Profile

4.15.24

ARORA; Hitesh - Surrey CA
Arora; Hitesh - Ithaca NY
Arora; Hitesh - Fremont CA
Arora; Hitesh - Chandler AZ
- Chandler AZ US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
A Method Of Immune Modulation By Modulating Abcf1 App 20220125876 - JEFFERIES; Wilfred ; et al.	2022-04-28
Monocrystalline epitaxially aligned nanostructures and related methods Grant 10,472,229 - Wiesner , et al. Nov	2019-11-12
Structures and methods for templated growth of high areal density heat assisted magnetic recording media Grant 10,347,281 - Arora , et al. July 9, 2	2019-07-09
Patterned block copolymer structure with oxide lines for line density multiplication Grant 9,719,170 - Arora , et al. August 1, 2	2017-08-01
Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials Grant 9,640,415 - Lowe, Jr. , et al. May 2, 2	2017-05-02
DBF film as a thermal interface material Grant 9,530,718 - Arora , et al. December 27, 2	2016-12-27
Structures And Methods For Templated Growth Of High Areal Density Heat Assisted Magnetic Recording Media App 20160358622 - Arora; Hitesh ; et al.	2016-12-08
Reduction Of Underfill Filler Settling In Integrated Circuit Packages App 20160343591 - Ramalingam; Suriyakala ; et al.	2016-11-24
Patterned Block Copolymer Structure With Oxide Lines For Line Density Multiplication App 20160319427 - Arora; Hitesh ; et al.	2016-11-03
Method for making a patterned perpendicular magnetic recording disk using glancing angle deposition of hard mask material Grant 9,464,348 - Arora , et al. October 11, 2	2016-10-11
Perpendicular magnetic recording disk with patterned template layer Grant 9,431,046 - Arora , et al. August 30, 2	2016-08-30
Method for reducing underfill filler settling in integrated circuit packages Grant 9,431,274 - Ramalingam , et al. August 30, 2	2016-08-30
Method for line density multiplication using block copolymers and sequential infiltration synthesis Grant 9,416,447 - Arora , et al. August 16, 2	2016-08-16
Method for making an imprint template with data regions and non-data regions using block copolymers Grant 9,336,809 - Arora , et al. May 10, 2	2016-05-10
Perpendicular Magnetic Recording Disk With Patterned Template Layer App 20160125904 - Arora; Hitesh ; et al.	2016-05-05
Method For Making A Patterned Perpendicular Magnetic Recording Disk Using Glancing Angle Deposition Of Hard Mask Material App 20160064026 - Arora; Hitesh ; et al.	2016-03-03
Method For Making An Imprint Template With Data Regions And Non-data Regions Using Block Copolymers App 20160064027 - Arora; Hitesh ; et al.	2016-03-03
Flexible Lead Frame For Multi-leg Package Assembly App 20150287901 - Lorimer; Adam ; et al.	2015-10-08
Method For Line Density Multiplication Using Block Copolymers And Sequential Infiltration Synthesis App 20150225850 - Arora; Hitesh ; et al.	2015-08-13
Robust Ink Formulations For Durable Markings On Microelectronic Packages And Its Extendibility As A Barrier Material For Thermal And Sealant Materials App 20150166804 - Lowe, JR.; Randall D. ; et al.	2015-06-18
Thermal interface material composition including polymeric matrix and carbon filler Grant 8,920,919 - Arora , et al. December 30, 2	2014-12-30
Thermal interface material composition including polymeric matrix and carbon filler Grant 08920919 -	2014-12-30
Thermal Interface Techniques And Configurations App 20140354314 - Arora; Hitesh ; et al.	2014-12-04
Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials Grant 8,900,919 - Lowe, Jr. , et al. December 2, 2	2014-12-02
Robust Ink Formulations For Durable Markings On Microelectronic Packages And Its Extendibility As A Barrier Material For Thermal And Sealant Materials App 20140264957 - Lowe, JR.; Randall D. ; et al.	2014-09-18
Dbf Film As A Thermal Interface Material App 20140177194 - Arora; Hitesh ; et al.	2014-06-26
Reduction Of Underfill Filler Settling In Integrated Circuit Packages App 20140177149 - Ramalingam; Suriyakala ; et al.	2014-06-26
Thermal Interface Material For Integrated Circuit Package Assembly And Associated Techniques And Configurations App 20140138854 - Arora; Hitesh	2014-05-22
Thermal Interface Material Composition Including Polymeric Matrix And Carbon Filler App 20140087200 - ARORA; Hitesh ; et al.	2014-03-27
Monocrystalline Epitaxially Aligned Nanostructures And Related Methods App 20130052421 - Wiesner; Ulrich ; et al.	2013-02-28

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.