Arnold; Shawn X.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Arnold; Shawn X..The latest application filed is for "segmented via for vertical pcb interconnect".
Company Profile
0.28.38
- Arnold; Shawn X. - San Jose CA
- Arnold; Shawn X. - Santa Cruz CA
Patent Activity
| Patent | Date |
|---|---|
| Low profile packaging and assembly of a power conversion system in modular form Grant 10,932,366 - Akre , et al. February 23, 2 | 2021-02-23 |
| Segmented via for vertical PCB interconnect Grant 10,420,213 - Beesley , et al. Sept | 2019-09-17 |
| Segmented Via For Vertical Pcb Interconnect App 20190075653 - Beesley; Mark J. ; et al. | 2019-03-07 |
| Capacitor structure with acoustic noise self-canceling characteristics Grant 10,179,254 - Martinez , et al. Ja | 2019-01-15 |
| Low Profile Packaging And Assembly Of A Power Conversion System In Modular Form App 20180228026 - Akre; Sunil M. ; et al. | 2018-08-09 |
| Multi-layered Ceramic Capacitors App 20180144870 - Ning; Gang ; et al. | 2018-05-24 |
| Low profile packaging and assembly of a power conversion system in modular form Grant 9,936,579 - Akre , et al. April 3, 2 | 2018-04-03 |
| Stacked Passive Component Structures App 20180061578 - Ning; Gang ; et al. | 2018-03-01 |
| Techniques for observing an entire communication bus in operation Grant 9,812,401 - Mason , et al. November 7, 2 | 2017-11-07 |
| Acoustically quiet capacitors Grant 9,805,867 - Arnold , et al. October 31, 2 | 2017-10-31 |
| Techniques For Observing An Entire Communication Bus In Operation App 20170265304 - Mason; Anne M. ; et al. | 2017-09-14 |
| Techniques For Observing An Entire Communication Bus In Operation App 20170263561 - Mason; Anne M. ; et al. | 2017-09-14 |
| Techniques for observing an entire communication bus in operation Grant 9,763,329 - Mason , et al. September 12, 2 | 2017-09-12 |
| Ceramic capacitors with built-in EMI shield Grant 9,715,964 - Ning , et al. July 25, 2 | 2017-07-25 |
| Capacitor Structure With Acoustic Noise Self-canceling Characteristics App 20170084395 - MARTINEZ; Paul A. ; et al. | 2017-03-23 |
| Surface Shaping Of Device Packages To Mitigate Fractures Under Bending Stress App 20170083042 - ARNOLD; Shawn X. ; et al. | 2017-03-23 |
| Printed circuits with embedded strain gauges Grant 9,593,991 - Mason , et al. March 14, 2 | 2017-03-14 |
| Printed Circuits With Embedded Strain Gauges App 20170030784 - Mason; Anne M. ; et al. | 2017-02-02 |
| Methods for forming a sensor array package Grant 9,402,316 - Arnold , et al. July 26, 2 | 2016-07-26 |
| Low cost repackaging of thinned integrated devices Grant 9,330,943 - Arnold May 3, 2 | 2016-05-03 |
| Ceramic Capacitors With Built-in Emi Shield App 20150364255 - Ning; Gang ; et al. | 2015-12-17 |
| Heel Fillet Capacitor With Noise Reduction App 20150364253 - Arnold; Shawn X. ; et al. | 2015-12-17 |
| Small form factor stacked electrical passive devices that reduce the distance to the ground plane Grant 9,215,807 - Arnold , et al. December 15, 2 | 2015-12-15 |
| Perimeter trench sensor array package Grant 9,190,379 - Arnold , et al. November 17, 2 | 2015-11-17 |
| Multi-layered Ceramic Capacitors App 20150310991 - NING; Gang ; et al. | 2015-10-29 |
| Direct multiple substrate die assembly Grant 9,117,873 - Arnold , et al. August 25, 2 | 2015-08-25 |
| Methods For Forming A Sensor Array Package App 20150230339 - Arnold; Shawn X. ; et al. | 2015-08-13 |
| Silicon shaping Grant 9,053,952 - Arnold , et al. June 9, 2 | 2015-06-09 |
| Low profile, space efficient circuit shields Grant 9,030,841 - Arnold , et al. May 12, 2 | 2015-05-12 |
| Methods for forming a sensor array package Grant 9,018,091 - Arnold , et al. April 28, 2 | 2015-04-28 |
| Three dimensional passive multi-component structures Grant 8,942,002 - Arnold , et al. January 27, 2 | 2015-01-27 |
| Multilayer laminated structure for plug and connector with spring finger interconnecting feature Grant 8,941,013 - Arnold January 27, 2 | 2015-01-27 |
| Devices and methods for embedding semiconductors in printed circuit boards Grant 8,809,859 - Arnold , et al. August 19, 2 | 2014-08-19 |
| Sensor Array Package App 20140227833 - Arnold; Shawn X. ; et al. | 2014-08-14 |
| Low Profile Packaging And Assembly Of A Power Conversion System In Modular Form App 20140218155 - Akre; Sunil M. ; et al. | 2014-08-07 |
| Three dimensional passive multi-component structures Grant 8,767,408 - Arnold , et al. July 1, 2 | 2014-07-01 |
| Low Cost Repackaging Of Thinned Integrated Devices App 20140159214 - ARNOLD; Shawn X. | 2014-06-12 |
| Sensor array package Grant 8,736,080 - Arnold , et al. May 27, 2 | 2014-05-27 |
| Devices And Methods For Embedding Semiconductors In Printed Circuit Boards App 20140134760 - Arnold; Shawn X. ; et al. | 2014-05-15 |
| Silicon Shaping App 20140091439 - ARNOLD; Shawn X. ; et al. | 2014-04-03 |
| Direct Multiple Substrate Die Assembly App 20140084454 - ARNOLD; Shawn X. ; et al. | 2014-03-27 |
| Small Form Factor Stacked Electrical Passive Devices That Reduce The Distance To The Ground Plane App 20140085851 - ARNOLD; Shawn X. ; et al. | 2014-03-27 |
| Perimeter Trench Sensor Array Package App 20140084425 - ARNOLD; Shawn X. ; et al. | 2014-03-27 |
| Acoustically Quiet Capacitors App 20140076621 - ARNOLD; Shawn X. ; et al. | 2014-03-20 |
| Devices and methods for embedding semiconductors in printed circuit boards Grant 8,664,656 - Arnold , et al. March 4, 2 | 2014-03-04 |
| Singulated Ic Stiffener And De-bond Process App 20140038357 - ARNOLD; Shawn X. ; et al. | 2014-02-06 |
| Pcb Manufacturing Process And Structure App 20140008110 - Arnold; Shawn X. ; et al. | 2014-01-09 |
| Spring Finger Interconnect App 20130319739 - ARNOLD; Shawn X. | 2013-12-05 |
| Sensor Array Package App 20130285263 - ARNOLD; Shawn X. ; et al. | 2013-10-31 |
| Method For Stabilizing Embedded Silicon App 20130277856 - ARNOLD; Shawn X. | 2013-10-24 |
| Low Profile, Space Efficient Circuit Shields App 20130223041 - Arnold; Shawn X. ; et al. | 2013-08-29 |
| Three Dimensional Passive Multi-component Structures App 20130201616 - ARNOLD; Shawn X. ; et al. | 2013-08-08 |
| Three Dimensional Passive Multi-component Structures App 20130201615 - ARNOLD; Shawn X. ; et al. | 2013-08-08 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 