Trademark applications and grants for Arnold, John. Arnold, John has 7 trademark applications. The latest application filed is for "PACERGLASS"
Entity Type | INDIVIDUAL |
Address | 2568 Humboldt St South Lake Tahoe, CALIFORNIA UNITED STATES 96150 |
Patent Application | Date |
---|---|
PLACING TOP VIAS AT LINE ENDS BY SELECTIVE GROWTH OF VIA MASK FROM LINE CUT DIELECTRIC 20220028784 - 17/499123 DUTTA; Ashim ;   et al. | 2022-01-27 |
Apparatus For Reducing Wafer Contamination During ION-Beam Etching Processes 20210183627 - 16/710232 Arnold; John ;   et al. | 2021-06-17 |
LITHO-ETCH-LITHO-ETCH WITH SELF-ALIGNED BLOCKS 20210143013 - 16/682494 Liu; Chi-Chun ;   et al. | 2021-05-13 |
EMBEDDING MAGNETO-RESISTIVE RANDOM-ACCESS MEMORY DEVICES BETWEEN METAL LEVELS 20210134883 - 16/672752 DUTTA; Ashim ;   et al. | 2021-05-06 |
Self-Aligned Top Via Formation at Line Ends 20210125865 - 16/664830 Dutta; Ashim ;   et al. | 2021-04-29 |
Litho-etch-litho-etch with self-aligned blocks 11,239,077 - 16/682,494 Liu , et al. February 1, 2 | 2022-02-01 |
Placing top vias at line ends by selective growth of via mask from line cut dielectric 11,189,561 - 16/574,447 Dutta , et al. November 30, 2 | 2021-11-30 |
Embedded MRAM device formation with self-aligned dielectric cap 11,189,783 - 16/578,729 Arnold , et al. November 30, 2 | 2021-11-30 |
MRAM device formation with controlled ion beam etch of MTJ 11,158,786 - 16/582,762 Dutta , et al. October 26, 2 | 2021-10-26 |
Self-aligned top via formation at line ends 11,152,261 - 16/664,830 Dutta , et al. October 19, 2 | 2021-10-19 |
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