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Patent applications and USPTO patent grants for Arnold; Dale.The latest application filed is for "solder bond site including an opening with discontinuous profile".
Patent | Date |
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Solder bond site including an opening with discontinuous profile Grant 10,847,382 - Gandhi , et al. November 24, 2 | 2020-11-24 |
Solder Bond Site Including An Opening With Discontinuous Profile App 20190393050 - Gandhi; Jaspreet S. ;   et al. | 2019-12-26 |
Solder bond site including an opening with discontinuous profile Grant 10,410,882 - Gandhi , et al. Sept | 2019-09-10 |
Solder Bond Site Including An Opening With Discontinuous Profile App 20190074194 - Gandhi; Jaspreet S. ;   et al. | 2019-03-07 |
Solder bond site including an opening with discontinuous profile Grant 9,881,858 - Gandhi , et al. January 30, 2 | 2018-01-30 |
Solder Bond Site Including An Opening With Discontinous Profile App 20170018489 - Gandhi; Jaspreet ;   et al. | 2017-01-19 |
Antistatic Fabric Containing Polyetherimide Filaments App 20150203995 - Adams; Edward Keith ;   et al. | 2015-07-23 |
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