loadpatents
name:-0.017235994338989
name:-0.003760814666748
name:-0.00052499771118164
Arndt; William R. Patent Filings

Arndt; William R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Arndt; William R..The latest application filed is for "heat sealable composite wrap material".

Company Profile
0.2.13
  • Arndt; William R. - Hilbert WI
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Heat Sealable Composite Wrap Material
App 20090020224 - Nowak; Michael R. ;   et al.
2009-01-22
Sandwich Wrappers, Fast Food Wrappers and Gum Wrappers Comprising PLA Resin
App 20080099540 - Mueller; LouAnn S. ;   et al.
2008-05-01
Sandwich wrappers, fast food wrappers, and gum wrappers comprising PLA resin
Grant 7,348,052 - Mueller , et al. March 25, 2
2008-03-25
High Strength Ream Wrap
App 20080026236 - Nowak; Michael R. ;   et al.
2008-01-31
High strength ream wrap
Grant 7,297,410 - Nowak , et al. November 20, 2
2007-11-20
Higher strength box for reams of wrapped paper
App 20060000735 - Arndt; William R. ;   et al.
2006-01-05
Ream wrap comprising PLA resin
App 20050148759 - Mueller, LouAnn S. ;   et al.
2005-07-07
Sandwich wrappers, fast food wrappers, and gum wrappers comprising PLA resin
App 20030211348 - Mueller, LouAnn S. ;   et al.
2003-11-13
Ream wrap comprising PLA resin
App 20030199218 - Mueller, LouAnn S. ;   et al.
2003-10-23
Heat sealable composite wrap material
App 20030143392 - Nowak, Michael R. ;   et al.
2003-07-31
Composite Wrap Material
App 20030129431 - NOWAK, MICHAEL R. ;   et al.
2003-07-10
High strength ream wrap
App 20030113567 - Nowak, Michael R. ;   et al.
2003-06-19
Insulation facing material z-fold area coating
App 20030082387 - Arndt, William R. ;   et al.
2003-05-01
Insulation facing material
App 20030082369 - Arndt, William R. ;   et al.
2003-05-01
Heat sealable composite wrap material
App 20020090508 - Nowak, Michael R. ;   et al.
2002-07-11

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