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Patent applications and USPTO patent grants for Armstrong; Ross L..The latest application filed is for "modular electronics for cylinders".
Patent | Date |
---|---|
Thermal conduction to a cylindrical shaft Grant 10,327,357 - Cornes , et al. | 2019-06-18 |
Alignment mechanism for cabling to a cylinder head Grant 9,439,312 - Cornes , et al. September 6, 2 | 2016-09-06 |
Modular Electronics For Cylinders App 20160088761 - WONG; Suzanne Marye ;   et al. | 2016-03-24 |
Thermal Conduction To A Cylindrical Shaft App 20160088776 - CORNES; Martin Peter John ;   et al. | 2016-03-24 |
Alignment Mechanism For Cabling To A Cylinder Head App 20160088751 - CORNES; Martin Peter John ;   et al. | 2016-03-24 |
Modular electronics for cylinders Grant 9,288,929 - Wong , et al. March 15, 2 | 2016-03-15 |
Method and apparatus for optimizing PCI interrupt binding and associated latency in extended/bridged PCI busses Grant 5,764,996 - Armstrong , et al. June 9, 1 | 1998-06-09 |
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