| Patent | Date |
|---|
Oxazine compound, composition, and cured product
Grant 11,117,873 - Arita , et al. September 14, 2 | 2021-09-14 |
Oxazine compound, composition and cured product
Grant 11,117,872 - Shimono , et al. September 14, 2 | 2021-09-14 |
Resin Composition, Cured Product, Laminate, And Electronic Member
App 20210269583 - OTSU; Masato ; et al. | 2021-09-02 |
Composition, cured product and laminate
Grant 11,104,788 - Otsu , et al. August 31, 2 | 2021-08-31 |
Oxazine compound, composition and cured product
Grant 11,028,059 - Shimono , et al. June 8, 2 | 2021-06-08 |
Substituted or unsubstituted allyl group-containing maleimide compound, production method therefor, and composition and cured product using said compound
Grant 10,981,865 - Yamaguchi , et al. April 20, 2 | 2021-04-20 |
Oxazine compound, composition and cured product
Grant 10,913,725 - Otsu , et al. February 9, 2 | 2021-02-09 |
Epoxy Compound, Composition, Cured Product And Laminate
App 20200331832 - Arita; Kazuo ; et al. | 2020-10-22 |
Substituted Or Unsubstituted Allyl Group-containing Maleimide Compound, Production Method Therefor, And Composition And Cured Product Using Said Compound
App 20200325100 - YAMAGUCHI; Junji ; et al. | 2020-10-15 |
Substituted Or Unsubstituted Allyl Group-containing Maleimide Compound, Production Method Therefor, And Composition And Cured Product Using Said Compound
App 20200325101 - YAMAGUCHI; Junji ; et al. | 2020-10-15 |
Composition, Cured Product And Laminate
App 20200109276 - Otsu; Masato ; et al. | 2020-04-09 |
Methods for producing polycyclic aromatic aminophenol compound and resin composition, and polycyclic aromatic aminophenol compound, resin composition, and cured product
Grant 10,577,307 - Arita , et al. | 2020-03-03 |
Oxazine compound, composition and cured product
Grant 10,399,312 - Otsu , et al. Sep | 2019-09-03 |
Curable resin composition, cured product thereof, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, build-up film, build-up substrate, fiber-reinforced composite material, and fiber-reinforced resin molded product
Grant 10,301,471 - Shimono , et al. | 2019-05-28 |
Methods For Producing Polycyclic Aromatic Aminophenol Compound And Resin Composition, And Polycyclic Aromatic Aminophenol Compou
App 20190144372 - Arita; Kazuo ; et al. | 2019-05-16 |
Oxazine Compound, Composition And Cured Product
App 20180362479 - Otsu; Masato ; et al. | 2018-12-20 |
Oxazine Compound, Composition And Cured Product
App 20180362477 - Shimono; Tomohiro ; et al. | 2018-12-20 |
Oxazine Compound, Composition, And Cured Product
App 20180362480 - ARITA; Kazuo ; et al. | 2018-12-20 |
Oxazine Compound, Composition And Cured Product
App 20180362478 - SHIMONO; Tomohiro ; et al. | 2018-12-20 |
Oxazine Compound, Composition And Cured Product
App 20180333941 - Otsu; Masato ; et al. | 2018-11-22 |
Thermosetting Resin Composition, Cured Product Obtained Therefrom, And Active Ester Resin For Use Therein
App 20180327541 - Arita; Kazuo ; et al. | 2018-11-15 |
Active ester resin, epoxy resin composition, cured product thereof, prepreg, circuit board, and build-up film
Grant 10,059,798 - Arita , et al. August 28, 2 | 2018-08-28 |
Active ester resin containing phosphorus atom, epoxy resin composition and cured product thereof, prepreg, circuit board, and build-up film
Grant 9,963,544 - Arita , et al. May 8, 2 | 2018-05-08 |
Epoxy Resin Composition And Cured Product Thereof
App 20170320994 - Arita; Kazuo ; et al. | 2017-11-09 |
Curable Resin Composition, Cured Product Thereof, Semiconductor Encapsulating Material, Semiconductor Device, Prepreg, Circuit Board, Build-up Film, Build-up Substrate, Fiber-reinforced Composite Material, And Fiber-reinforced Resin Molded Product
App 20170101532 - Shimono; Tomohiro ; et al. | 2017-04-13 |
Epoxy resin, method for producing epoxy resin, epoxy resin composition, cured product thereof, and heat-dissipating resin material
Grant 9,441,069 - Arita , et al. September 13, 2 | 2016-09-13 |
Active Ester Resin Containing Phosphorus Atom, Epoxy Resin Composition And Cured Product Thereof, Prepreg, Circuit Board, And Build-up Film
App 20160130391 - Arita; Kazuo ; et al. | 2016-05-12 |
Active ester resin, thermosetting resin composition, cured product of same, semiconductor encapsulation material, prepreg, circuit board, and build-up film
Grant 9,217,053 - Suzuki , et al. December 22, 2 | 2015-12-22 |
Active Ester Resin, Epoxy Resin Composition, Cured Product Thereof, Prepreg, Circuit Board, And Build-up Film
App 20150344617 - Arita; Kazuo ; et al. | 2015-12-03 |
Active Ester Resin, Thermosetting Resin Composition, Cured Product Of Same, Semiconductor Encapsulation Material, Prepreg, Circuit Board, And Build-up Film
App 20150118499 - Suzuki; Etsuko ; et al. | 2015-04-30 |
Epoxy Resin, Method For Producing Expoxy Resin, Epoxy Resin Composition, Cured Product Thereof, And Heat-dissipating Resin Material
App 20150104651 - Arita; Kazuo ; et al. | 2015-04-16 |
Active ester resin, method for producing the same, thermosetting resin composition, cured product of the thermosetting resin composition, semiconductor encapsulating material, pre-preg, circuit board, and build-up film
Grant 8,791,214 - Takeuchi , et al. July 29, 2 | 2014-07-29 |
Active Ester Resin, Method For Producing The Same, Thermosetting Resin Composition, Cured Product Of The Thermosetting Resin Composition, Semiconductor Encapsulating Material, Pre-preg, Circuit Board, And Build-up Film
App 20140151094 - Takeuchi; Kan ; et al. | 2014-06-05 |
Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol resin and semiconductor-encapsulating material
Grant 8,729,192 - Arita , et al. May 20, 2 | 2014-05-20 |
Thermosetting resin composition, cured product thereof, active ester resin, semiconductor encapsulating material, prepreg, circuit board, and build-up film
Grant 8,669,333 - Arita , et al. March 11, 2 | 2014-03-11 |
Thermosetting Resin Composition, Cured Product Thereof, Active Ester Resin, Semiconductor Encapsulating Material, Prepreg, Circuit Board, And Build-up Film
App 20130101857 - Arita; Kazuo ; et al. | 2013-04-25 |
Phenol resin composition, production method therefor, curable resin composition, cured product thereof, and printed circuit board
Grant 8,394,911 - Satou , et al. March 12, 2 | 2013-03-12 |
Phenol Resin Composition, Production Method Therefor, Curable Resin Composition, Cured Product Thereof, And Printed Circuit Board
App 20120308832 - Satou; Yutaka ; et al. | 2012-12-06 |
Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin
Grant 8,263,714 - Ogura , et al. September 11, 2 | 2012-09-11 |
Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same
Grant 8,168,731 - Satou , et al. May 1, 2 | 2012-05-01 |
Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin
Grant 8,084,567 - Ogura , et al. December 27, 2 | 2011-12-27 |
Epoxy Resin Composition, Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin, Method For Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin
App 20110275739 - Ogura; Ichiro ; et al. | 2011-11-10 |
Curable Resin Composition, Cured Product Thereof, Printed Wiring Board, Epoxy Resin, And Process For Producing The Same
App 20110259628 - Satou; Yutaka ; et al. | 2011-10-27 |
Epoxy resin composition,cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin,method for producing novel phenol resin, and method for producing novel epoxy resin
Grant 7,985,822 - Ogura , et al. July 26, 2 | 2011-07-26 |
Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin
Grant 7,718,741 - Ogura , et al. May 18, 2 | 2010-05-18 |
Epoxy Resin Composition And Cured Article Thereof, Novel Epoxy Resin And Production Method Thereof, And Novel Phenol Resin
App 20100056747 - OGURA; Ichirou ; et al. | 2010-03-04 |
Epoxy Resin Composition, Cured Article Thereof, Novel Epoxy Resin, Novel Phenol Resin And Semiconductor-encapsulating Material
App 20090099303 - Arita; Kazuo ; et al. | 2009-04-16 |
Method Of Producing Phenol Resin And Method Of Producing Epoxy Resin
App 20090088535 - Arita; Kazuo ; et al. | 2009-04-02 |
Epoxy Resin Composition And Cured Article Thereof, Novel Epoxy Resin And Production Method Thereof, And Novel Phenol Resin
App 20090069490 - Ogura; Ichirou ; et al. | 2009-03-12 |
Epoxy Resin Composition,Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin,Method for Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin
App 20080255315 - Ogura; Ichiro ; et al. | 2008-10-16 |
Preparing epoxy resin by distilling two fractions to recover and reuse epihalohydrin without glycidol
Grant 6,794,478 - Ogura , et al. September 21, 2 | 2004-09-21 |
Process for preparing epoxy resin
App 20030073802 - Ogura, Ichiro ; et al. | 2003-04-17 |
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