Arisawa; Tatsuya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Arisawa; Tatsuya.The latest application filed is for "copper-clad laminate, wiring board, and copper foil provided with resin".

Company Profile

6.6.8

Arisawa; Tatsuya - Fukushima JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal-clad laminated board, metal member provided with resin, and wiring board Grant 11,330,710 - Arisawa , et al. May 10, 2	2022-05-10
Resin composition, prepreg, film including resin, metal foil including resin, metal-clad laminate, and wiring board Grant 11,312,858 - Arisawa , et al. April 26, 2	2022-04-26
Metal-clad laminated board, method for producing metal-clad laminated board, resin-attached metal member, method for producing resin-attached metal member, wiring board and method for producing wiring board Grant 11,267,225 - Arisawa , et al. March 8, 2	2022-03-08
Copper-clad Laminate, Wiring Board, And Copper Foil Provided With Resin App 20220015230 - INOUE; Yuki ; et al.	2022-01-13
Metal-clad Laminate, Wiring Board, Metal Foil Provided With Resin, And Resin Composition App 20210395452 - ARISAWA; Tatsuya ; et al.	2021-12-23
Resin composition, method for producing resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board Grant 11,078,361 - Arisawa , et al. August 3, 2	2021-08-03
Resin Composition, Prepreg, Film Including Resin, Metal Foil Including Resin, Metal-clad Laminate, And Wiring Board App 20210079215 - ARISAWA; Tatsuya ; et al.	2021-03-18
Metal-clad Laminated Board, Metal Member Provided With Resin, And Wiring Board App 20210014967 - ARISAWA; Tatsuya ; et al.	2021-01-14
Metal-clad laminate, metal member with resin, and wiring board Grant 10,820,413 - Inoue , et al. October 27, 2	2020-10-27
Metal-clad Laminated Board, Method For Producing Metal-clad Laminated Board, Resin-attached Metal Member, Method For Producing R App 20190270280 - ARISAWA; TATSUYA ; et al.	2019-09-05
Resin Composition, Method For Producing Resin Composition, Prepreg, Film With Resin, Metal Foil With Resin, Metal-clad Laminate, App 20190203045 - ARISAWA; Tatsuya ; et al.	2019-07-04
Metal-clad Laminate, Metal Member With Resin, And Wiring Board App 20190014661 - INOUE; YUKI ; et al.	2019-01-10
Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring board Grant 9,775,239 - Arisawa , et al. September 26, 2	2017-09-26
Resin Composition For Printed Wiring Board, Prepreg, Metal-clad Laminate, And Printed Wiring Board App 20170099731 - ARISAWA; TATSUYA ; et al.	2017-04-06

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