Arimitsu; Yukio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Arimitsu; Yukio.The latest application filed is for "air filter unit and air conditioner".

Company Profile

0.25.51

Arimitsu; Yukio - Osaka JP
ARIMITSU; Yukio - Ibaraki-shi JP
Arimitsu; Yukio - Ibaraki N/A JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Air filter medium, filter pleat pack, and air filter unit Grant 11,338,233 - Horie , et al. May 24, 2	2022-05-24
Air Filter Unit And Air Conditioner App 20210252445 - MORI; Masaaki ; et al.	2021-08-19
Air Filter Medium, Filter Pleat Pack, And Air Filter Unit App 20200230536 - HORIE; Yuri ; et al.	2020-07-23
Method For Manufacturing Fuel-cell Membrane Electrode Assembly App 20160285120 - NAKANO; Takeshi ; et al.	2016-09-29
Pressure-sensitive Adhesive Sheet For Conveying Electrolyte Membrane And Method Using Said Pressure-sensitive Adhesive Sheet To Manufacture Fuel-cell Membrane Electrode Assembly App 20160254559 - NAKANO; Takeshi ; et al.	2016-09-01
Double-sided adhesive tape or sheet, and adherend processing method Grant 9,120,955 - Arimitsu September 1, 2	2015-09-01
Double-sided Adhesive Tape Or Sheet, And Adherend Processing Method App 20140002953 - Arimitsu; Yukio	2014-01-02
Pressure-sensitive Adhesive Tape For Protecting Surface Of Semiconductor Parts App 20130344274 - Fukuhara; Junji ; et al.	2013-12-26
Double-sided Adhesive Tape Or Sheet, And Adherend Processing Method App 20130335879 - Arimitsu; Yukio	2013-12-19
Laminate App 20130251985 - Nakanishi; Tadatoshi ; et al.	2013-09-26
Heat-resistant Pressure-sensitive Adhesive Tape For Production Of Semiconductor Device And Method For Producing Semiconductor Device Using The Tape App 20130244377 - ARIMITSU; Yukio	2013-09-19
Pressure-sensitive Adhesive Tape For Resin Encapsulation And Method For Producing Resin Encapsulation Type Semiconductor Device App 20130237017 - KONDO; Hiroyuki ; et al.	2013-09-12
Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatus Grant 8,524,007 - Uenda , et al. September 3, 2	2013-09-03
Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet Grant 8,524,361 - Soejima , et al. September 3, 2	2013-09-03
Polymer For Pressure Sensitive Adhesive, Pressure Sensitive Adhesive Composition And Heat-peelable Pressure Sensitive Adhesive Sheet App 20130186565 - ARIMITSU; Yukio ; et al.	2013-07-25
Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatus Grant 8,475,600 - Uenda , et al. July 2, 2	2013-07-02
Heat-resistant adhesive sheet for substrateless semiconductor package fabrication and method for fabricating substrateless semiconductor package using the adhesive sheet Grant 8,436,481 - Hoshino , et al. May 7, 2	2013-05-07
Process for producing organic electroluminescent panel Grant 8,409,884 - Hirayama , et al. April 2, 2	2013-04-02
Method For Manufacturing Thin-film Substrate App 20120223455 - SHINTANI; Toshio ; et al.	2012-09-06
Tackiness Adhesive Sheet For Thin-film Substrate Fixing App 20120222805 - SHINTANI; Toshio ; et al.	2012-09-06
Adhesive Sheet, Process For Producing The Same, And Method Of Cutting Multilayered Ceramic Sheet App 20110200744 - HIRAYAMA; Takamasa ; et al.	2011-08-18
Heat-resistant Adhesive Sheet For Substrateless Semiconductor Package Fabrication And Method For Fabricating Substrateless Semiconductor Package Using The Adhesive Sheet App 20110151625 - HOSHINO; Shinji ; et al.	2011-06-23
Process For Producing Organic Electroluminescent Panel App 20110124136 - Hirayama; Takamasa ; et al.	2011-05-26
Electronic paper manufacturing method and double-sided adhesive tape for electronic paper formation process App 20110094675 - Sato; Masaaki ; et al.	2011-04-28
Cleaning Sheet, Transfer Member Provided With Cleaning Function, And Method For Cleaning Substrate Processing Apparatus App 20110088721 - Uenda; Daisuke ; et al.	2011-04-21
Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet Grant 7,811,647 - Arimitsu , et al. October 12, 2	2010-10-12
Heat-peelable Pressure-sensitive Adhesive Sheet For Cutting Laminated Ceramic Sheet And Method For Cut-processing Laminated Ceramic Sheet App 20100224316 - SOEJIMA; Kazuki ; et al.	2010-09-09
Heat-peelable Pressure-sensitive Adhesive Sheet For Cutting Laminated Ceramic Sheet And Method For Cut-processing Laminated Ceramic Sheet App 20100215882 - YANAGI; Yuichiro ; et al.	2010-08-26
Heat-peelable pressure-sensitive adhesive sheet Grant 7,718,257 - Murata , et al. May 18, 2	2010-05-18
Heat-peelabe Pressure-sensitive Adhesive Sheet Containing Layered Silicate And Process For The Production For Electronic Components By The Use Of The Sheet App 20100119816 - Shimokawa; Daisuke ; et al.	2010-05-13
Heat-peelable Double-sided Pressure-sensitive Adhesive Sheet App 20100119757 - Shimokawa; Daisuke ; et al.	2010-05-13
Heat-peelable Pressure-sensitive Adhesive Sheet App 20100119791 - Arimitsu; Yukio ; et al.	2010-05-13
Thermal-release double-coated pressure-sensitive adhesive tape or sheet and method of processing adherend Grant 7,691,225 - Kishimoto , et al. April 6, 2	2010-04-06
Method of thermal adherend release and apparatus for thermal adherend release Grant 7,641,760 - Doi , et al. January 5, 2	2010-01-05
Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet Grant 7,635,516 - Arimitsu , et al. December 22, 2	2009-12-22
Cleaning Sheet, Transfer Member Provided With Cleaning Function, And Method For Cleaning Substrate Processing Apparatus App 20090263153 - Uenda; Daisuke ; et al.	2009-10-22
Thermal-release double-coated pressure-sensitive adhesive tape or sheet and method of processing adherend App 20080169062 - Kishimoto; Tomoko ; et al.	2008-07-17
Heat-Peelable Pressure-Sensitive Adhesive Sheet and Method for Processing Adherend Using the Heat-Peelable Pressure-Sensitive Adhesive Sheet App 20080160293 - Arimitsu; Yukio ; et al.	2008-07-03
Method for thermally releasing adherend and apparatus for thermally releasing adherend App 20080073034 - Izutani; Seiji ; et al.	2008-03-27
Adhesive Sheet, Process For Producing The Same, And Method Of Cutting Multilayered Ceramic Sheet App 20080038540 - HIRAYAMA; Takamasa ; et al.	2008-02-14
Heat-Peelable Pressure-Sensitive Adhesive Sheet and Method for Processing Adherend Using the Heat-Peelable Pressure-Sensitive Adhesive Sheet App 20080019078 - Arimitsu; Yukio ; et al.	2008-01-24
Heat-peelable pressure-sensitive adhesive sheet App 20080008831 - Kishimoto; Tomoko ; et al.	2008-01-10
Method for thermally releasing chip cut piece from thermal release type pressure sensitive adhesive sheet, electronic component and circuit board App 20070111392 - Murata; Akihisa ; et al.	2007-05-17
Heat-peelable pressure-sensitive adhesive sheet Grant 7,214,424 - Kiuchi , et al. May 8, 2	2007-05-08
Heat-peelable adhesive sheet Grant 7,175,728 - Kiuchi , et al. February 13, 2	2007-02-13
Heat-peelable pressure-sensitive adhesive sheet Grant 7,163,597 - Murata , et al. January 16, 2	2007-01-16
Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same Grant 7,147,743 - Kiuchi , et al. December 12, 2	2006-12-12
Heat-peelable adhesive sheet Grant 7,067,030 - Kiuchi , et al. June 27, 2	2006-06-27
Method of thermal adherend release and apparatus for thermal adherend release App 20060124241 - Doi; Tomoko ; et al.	2006-06-15
Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same Grant 7,029,550 - Kiuchi , et al. April 18, 2	2006-04-18
Heat-peelable pressure-sensitive adhesive sheet Grant 6,998,175 - Murata , et al. February 14, 2	2006-02-14
Method of thermal adherend release and apparatus for thermal adherend release App 20050236107 - Doi, Tomoko ; et al.	2005-10-27
Heat-peelable adhesive sheet App 20050186419 - Kiuchi, Kazuyuki ; et al.	2005-08-25
Heat-peelable pressure-sensitive adhesive sheet App 20050136251 - Kishimoto, Tomoko ; et al.	2005-06-23
Method of heat-peeling chip cut pieces from heat peel type adhesive sheet, electronic part, and circuit board App 20040177918 - Murata, Akihisa ; et al.	2004-09-16
Heat-peelable pressure-sensitive adhesive sheet App 20040038020 - Murata, Akihisa ; et al.	2004-02-26
Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same App 20040003883 - Kiuchi, Kazuyuki ; et al.	2004-01-08
Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same App 20040000370 - Kiuchi, Kazuyuki ; et al.	2004-01-01
Heat-peelable adhesive sheet App 20030203192 - Kiuchi, Kazuyuki ; et al.	2003-10-30
Heat-peelable pressure-sensitive adhesive sheet App 20030203193 - Murata, Akihisa ; et al.	2003-10-30
Method for thermally releasing adherend and apparatus for thermally releasing adherend App 20020195199 - Izutani, Seiji ; et al.	2002-12-26
Heat-peelable pressure-sensitive adhesive sheet App 20020192463 - Kiuchi, Kazuyuki ; et al.	2002-12-19
Heat-peelable pressure-sensitive adhesive sheet App 20010055678 - Murata, Akihisa ; et al.	2001-12-27
Radiation-curable heat-peelable pressure-sensitive adhesive sheet and process for producing cut pieces with the same App 20010019765 - Kiuchi, Kazuyuki ; et al.	2001-09-06

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