Arikawa; Tadashi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Arikawa; Tadashi.The latest application filed is for "plating film and plated member".

Company Profile

2.8.7

Arikawa; Tadashi - Sakata JP
ARIKAWA; Tadashi - Sakata-shi Yamagata
Arikawa; Tadashi - Toyama JP
ARIKAWA; Tadashi - Toyama-shi JP
Arikawa; Tadashi - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Plating film and plated member Grant 11,380,602 - Goto , et al. July 5, 2	2022-07-05
Plating Film And Plated Member App 20210013122 - GOTO; Kengo ; et al.	2021-01-14
Heat spreader and method for manufacturing the same Grant 10,215,512 - Oki , et al. Feb	2019-02-26
Heat Spreader And Method For Manufacturing The Same App 20170198991 - OKI; Hiroaki ; et al.	2017-07-13
Composite material, method for producing same and member using same Grant 7,547,412 - Itoh , et al. June 16, 2	2009-06-16
Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions App 20060246314 - Osada; Mitsuo ; et al.	2006-11-02
Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions Grant 7,083,759 - Osada , et al. August 1, 2	2006-08-01
Composite material, method for producing same and member using same App 20050287387 - Itoh, Masayuki ; et al.	2005-12-29
Semiconductor package and method for producing heat-radiating substrate for it Grant 6,926,861 - Hirayama , et al. August 9, 2	2005-08-09
Semiconductor package and method for producing heat-radiating substrate for it App 20040056352 - Hirayama, Norio ; et al.	2004-03-25
Semiconductor package and method for producing heat-radiating substrate for it Grant 6,693,353 - Hirayama , et al. February 17, 2	2004-02-17
Material of heat-dissipating plate on which semiconductor is mounted, method for fabricating the same, and ceramic package produced by using the same App 20020191377 - Osada, Mitsuo ; et al.	2002-12-19
Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same App 20020017346 - Osada, Mitsuo ; et al.	2002-02-14
Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same Grant 6,271,585 - Osada , et al. August 7, 2	2001-08-07
Plastic-packaged semiconductor device having a heat sink matched with a plastic package Grant 5,493,153 - Arikawa , et al. February 20, 1	1996-02-20

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