Archer, III; Vance D.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Archer, III; Vance D..The latest application filed is for "routing under bond pad for the replacement of an interconnect layer".
- Archer, III; Vance D. - Greensboro NC
| Patent | Date |
|---|---|
| Routing Under Bond Pad For The Replacement Of An Interconnect Layer App 20130056868 - Archer, III; Vance D. ; et al. | 2013-03-07 |
| Routing under bond pad for the replacement of an interconnect layer Grant 8,319,343 - Archer, III , et al. November 27, 2 | 2012-11-27 |
| Thermal monitoring and management of integrated circuits Grant 7,973,544 - Archer, III , et al. July 5, 2 | 2011-07-05 |
| Thermal Monitoring And Management Of Integrated Circuits App 20100045326 - Archer, III; Vance D. ; et al. | 2010-02-25 |
| Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink Grant 7,429,502 - Archer, III , et al. September 30, 2 | 2008-09-30 |
| Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink Grant 7,327,029 - Archer, III , et al. February 5, 2 | 2008-02-05 |
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