Arancio; Vincenzo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Arancio; Vincenzo.The latest application filed is for "polymer thick film dielectric paste composition".

Company Profile

1.5.7

Arancio; Vincenzo - Bristol GB

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polymer thick film dielectric paste composition Grant 11,064,605 - Lee , et al. July 13, 2	2021-07-13
Polymer Thick Film Dielectric Paste Composition App 20190387621 - Lee; Hee Hyun ; et al.	2019-12-19
Printable compositions useful in electronic applications and methods relating thereto Grant 9,862,846 - Greenhill , et al. January 9, 2	2018-01-09
Thermally conductive dielectric for thermoformable circuits Grant 9,346,992 - Arancio , et al. May 24, 2	2016-05-24
Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits Grant 9,245,666 - Dorfman , et al. January 26, 2	2016-01-26
Printable Compositions Useful In Electronic Applications And Methods Relating Thereto App 20150337148 - GREENHILL; DAVID ANDREW ; et al.	2015-11-26
Photonic Sintering Of Polymer Thick Film Conductor Compositions App 20150213916 - ARANCIO; VINCENZO ; et al.	2015-07-30
Thermally Conductive Dielectric For Thermoformable Circuits App 20150034473 - ARANCIO; Vincenzo ; et al.	2015-02-05
Thermoformable Polymer Thick Film Silver Conductor And Its Use In Capacitive Switch Circuits App 20140154501 - DORFMAN; JAY ROBERT ; et al.	2014-06-05
Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits Grant 8,692,131 - Dorfman , et al. April 8, 2	2014-04-08
Thermoformable Polymer Thick Film Silver Conductor And Its Use In Capacitive Switch Circuits App 20140037941 - DORFMAN; JAY ROBERT ; et al.	2014-02-06
Thermoformable Polymer Thick Film Silver Conductor And Its Use In Capacitive Switch Circuits App 20130206570 - DORFMAN; JAY ROBERT ; et al.	2013-08-15

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