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Patent applications and USPTO patent grants for ARAKAWA; Keita.The latest application filed is for "polishing liquid, polishing liquid set, and polishing method".
Patent | Date |
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Polishing Liquid, Polishing Liquid Set, And Polishing Method App 20210062041 - ARAKAWA; Keita ;   et al. | 2021-03-04 |
Slurry, Polishing-liquid Set, Polishing Liquid, Method For Polishing Substrate, And Substrate App 20200325360 - MINAMI; Hisataka ;   et al. | 2020-10-15 |
Slurry, polishing-liquid set, polishing liquid, method for polishing substrate, and substrate Grant 10,752,807 - Minami , et al. A | 2020-08-25 |
Slurry, Polishing-liquid Set, Polishing Liquid, Method For Polishing Substrate, And Substrate App 20160222252 - MINAMI; Hisataka ;   et al. | 2016-08-04 |
Supercooling Promoting Agent App 20130004936 - Fujikawa; Seizo ;   et al. | 2013-01-03 |
Supercooling Promoting Agent App 20110078916 - Fujikawa; Seizo ;   et al. | 2011-04-07 |
Supercooling promoting agent Grant 7,837,895 - Fujikawa , et al. November 23, 2 | 2010-11-23 |
Supercooling promoting agent App 20090302265 - Fujikawa; Seizo ;   et al. | 2009-12-10 |
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