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name:-0.0029401779174805
name:-0.0037031173706055
ARAKAWA; Keita Patent Filings

ARAKAWA; Keita

Patent Applications and Registrations

Patent applications and USPTO patent grants for ARAKAWA; Keita.The latest application filed is for "polishing liquid, polishing liquid set, and polishing method".

Company Profile
3.2.6
  • ARAKAWA; Keita - Chiyoda-ku Tokyo
  • ARAKAWA; Keita - Tokyo JP
  • Arakawa; Keita - Hokkaido JP
  • Arakawa; Keita - Sapporo-shi JP
  • Arakawa; Keita - Sapporo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Polishing Liquid, Polishing Liquid Set, And Polishing Method
App 20210062041 - ARAKAWA; Keita ;   et al.
2021-03-04
Slurry, Polishing-liquid Set, Polishing Liquid, Method For Polishing Substrate, And Substrate
App 20200325360 - MINAMI; Hisataka ;   et al.
2020-10-15
Slurry, polishing-liquid set, polishing liquid, method for polishing substrate, and substrate
Grant 10,752,807 - Minami , et al. A
2020-08-25
Slurry, Polishing-liquid Set, Polishing Liquid, Method For Polishing Substrate, And Substrate
App 20160222252 - MINAMI; Hisataka ;   et al.
2016-08-04
Supercooling Promoting Agent
App 20130004936 - Fujikawa; Seizo ;   et al.
2013-01-03
Supercooling Promoting Agent
App 20110078916 - Fujikawa; Seizo ;   et al.
2011-04-07
Supercooling promoting agent
Grant 7,837,895 - Fujikawa , et al. November 23, 2
2010-11-23
Supercooling promoting agent
App 20090302265 - Fujikawa; Seizo ;   et al.
2009-12-10

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