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ARAIDA; Yasuro Patent Filings

ARAIDA; Yasuro

Patent Applications and Registrations

Patent applications and USPTO patent grants for ARAIDA; Yasuro.The latest application filed is for "heat-resistant fiber structure".

Company Profile
0.4.6
  • ARAIDA; Yasuro - Okayama-shi JP
  • Araida; Yasuro - Osaka N/A JP
  • Araida; Yasuro - Osaka-shi JP
  • Araida, Yasuro - Ohsaka-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Heat-resistant Fiber Structure
App 20190055684 - KOIZUMI; Satoshi ;   et al.
2019-02-21
Molded object having nonwoven fibrous structure
Grant 9,758,925 - Kimura , et al. September 12, 2
2017-09-12
Conjugated Fiber And Structural Fiber Product Comprising The Conjugated Fiber
App 20140363653 - Hori; Teruo ;   et al.
2014-12-11
Stretchable nonwoven fabric and tape
Grant 8,518,841 - Kimura , et al. August 27, 2
2013-08-27
Stretchable Nonwoven Fabric And Tape
App 20100035500 - Kimura; Tomoaki ;   et al.
2010-02-11
Molded Object Having Nonwoven Fibrous Structure
App 20090130939 - Kimura; Tomoaki ;   et al.
2009-05-21
Adhesive film for adhesive bandage and adhesive bandage using said adhesive film
App 20010028943 - Mashiko, Yasushi ;   et al.
2001-10-11

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