Arai; Hideta

Patent Applications and Registrations

Patent applications and USPTO patent grants for Arai; Hideta.The latest application filed is for "surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic device".

Company Profile

8.21.28

Arai; Hideta - Ibaraki JP
Arai; Hideta - Hitachi JP
Arai; Hideta - lbaraki JP
Arai; Hideta - Hitachi-shi JP
Arai; Hideta - Hitashi N/A JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device Grant 10,925,170 - Ori , et al. February 16, 2	2021-02-16
Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic device Grant 10,925,171 - Ori , et al. February 16, 2	2021-02-16
Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device Grant 10,820,414 - Arai , et al. October 27, 2	2020-10-27
Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device Grant 10,791,631 - Ori , et al. September 29, 2	2020-09-29
Surface-treated copper foil, and current collector, electrode, and battery cell using the surface-treated copper foil Grant 10,529,992 - Arai , et al. J	2020-01-07
Copper foil for printed circuit Grant 10,472,728 - Arai , et al. Nov	2019-11-12
Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board Grant 10,464,291 - Momoi , et al. No	2019-11-05
Surface-treated copper foil Grant 10,383,222 - Miki , et al. A	2019-08-13
Printed wiring board, electronic device, catheter, and metallic material Grant 10,194,534 - Arai , et al. Ja	2019-01-29
Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, And Method For Manufacturing Electronic Device App 20180288881 - Ori; Yuki ; et al.	2018-10-04
Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, Heat Dissipation Substrate, And Method For Manufacturing Electronic Device App 20180288884 - Ori; Yuki ; et al.	2018-10-04
Surface-treated Copper Foil, And Current Collector, Electrode, And Battery Cell Using The Surface-treated Copper Foil App 20180226655 - Arai; Hideta ; et al.	2018-08-09
Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Method for Manufacturing Printed Wiring Board, and Method for Manufacturing Electronic Device App 20180160529 - Arai; Hideta ; et al.	2018-06-07
Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Method for Manufacturing Printed Wiring Board, and Method for Manufacturing Electronic Device App 20180160546 - Ori; Yuki ; et al.	2018-06-07
Structure Having Metal Material For Heat Radiation, Printed Circuit Board, Electronic Apparatus, And Metal Material For Heat Radiation App 20180035529 - ARAI; HIDETA ; et al.	2018-02-01
Printed Wiring Board, Electronic Device, Catheter, And Metallic Material App 20180035546 - ARAI; HIDETA ; et al.	2018-02-01
Structure Having Metal Material For Heat Radiation, Printed Circuit Board, Electronic Apparatus, And Metal Material For Heat Radiation App 20170347493 - Arai; Hideta ; et al.	2017-11-30
Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board App 20170291397 - MOMOI; Hajime ; et al.	2017-10-12
Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate Grant 9,730,332 - Arai , et al. August 8, 2	2017-08-08
Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board Grant 9,724,896 - Momoi , et al. August 8, 2	2017-08-08
Surface-Treated Copper Foil App 20170196083 - Miki; Atsushi ; et al.	2017-07-06
Copper foil for printed circuit Grant 9,580,829 - Arai , et al. February 28, 2	2017-02-28
Surface treated copper foil and laminate using the same Grant 9,504,149 - Arai , et al. November 22, 2	2016-11-22
Surface Treated Copper Foil, Copper Clad Laminate, Printed Wiring Board, Electronic Apparatus and Method for Manufacturing Printed Wiring Board App 20160303829 - Arai; Hideta ; et al.	2016-10-20
Copper Foil For Printed Circuit App 20160286665 - Arai; Hideta ; et al.	2016-09-29
Surface-Treated Metal Material, Metal Foil With Carrier, Connector, Terminal, Laminate, Shielding Tape, Shielding Material, Printed Wiring Board, Processed Metal Member, Electronic Device, And Method For Manufacturing Printed Wiring Board App 20160212836 - Arai; Hideta ; et al.	2016-07-21
Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board App 20160120017 - MOMOI; HAJIME ; et al.	2016-04-28
Surface treated copper foil and laminate using the same Grant 9,232,650 - Arai , et al. January 5, 2	2016-01-05
Surface Treated Copper Foil and Laminate Using the Same App 20150245477 - Arai; Hideta ; et al.	2015-08-27
Surface Treated Copper Foil And Laminate Using The Same, Printed Wiring Board, And Copper Clad Laminate App 20150237737 - Arai; Hideta ; et al.	2015-08-20
Liquid crystal polymer copper-clad laminate and copper foil used for said laminate Grant 9,060,431 - Arai , et al. June 16, 2	2015-06-16
Rolled copper or copper-alloy foil provided with roughened surface Grant 9,049,795 - Arai , et al. June 2, 2	2015-06-02
Surface Treated Copper Foil and Laminate Using the Same App 20140355229 - Arai; Hideta ; et al.	2014-12-04
Liquid Crystal Polymer Copper-Clad Laminate and Copper Foil Used For Said Laminate App 20140093743 - Arai; Hideta ; et al.	2014-04-03
Copper Foil For Printed Circuit App 20140057123 - Arai; Hideta ; et al.	2014-02-27
Rolled Copper or Copper-Alloy Foil Provided with Roughened Surface App 20140037976 - Arai; Hideta ; et al.	2014-02-06
Copper foil for printed circuit Grant 8,524,378 - Arai , et al. September 3, 2	2013-09-03
Laminate For Flexible Wiring App 20130071652 - Yamanishi; Keisuke ; et al.	2013-03-21
Copper Foil For Negative Electrode Current Collector Of Secondary Battery App 20130011734 - Arai; Hideta ; et al.	2013-01-10
Copper Foil for Printed Circuit App 20130011690 - Arai; Hideta ; et al.	2013-01-10
Copper Foil for Printed Circuit App 20110262764 - Arai; Hideta ; et al.	2011-10-27

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