APPELT; Bernd Karl

Patent Applications and Registrations

Patent applications and USPTO patent grants for APPELT; Bernd Karl.The latest application filed is for "substrate structure, package structure and method for manufacturing electronic package structure".

Company Profile

12.36.48

APPELT; Bernd Karl - Holly Springs NC
Appelt; Bernd Karl - Kaohsiung TW
Appelt; Bernd Karl - Gulf Breeze FL
Appelt; Bernd Karl - Hanroth DE
APPELT; Bernd Karl - Sunnyvale CA
Appelt; Bernd Karl - Endicott NY
Appelt; Bernd Karl - Apalachin NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate Structure, Package Structure And Method For Manufacturing Electronic Package Structure App 20220310410 - YEN; You-Lung ; et al.	2022-09-29
Substrate Structure, Semiconductor Package Structure And Method For Manufacturing Semiconductor Package Structure App 20220301989 - YEN; You-Lung ; et al.	2022-09-22
Semiconductor Device Package And Method Of Manufacturing The Same App 20220302004 - YEN; You-Lung ; et al.	2022-09-22
Semiconductor Device Package App 20220302008 - YEN; You-Lung ; et al.	2022-09-22
Semiconductor device packages and method of manufacturing the same Grant 11,322,454 - Yen , et al. May 3, 2	2022-05-03
Semiconductor device package and method of manufacturing the same Grant 11,322,428 - Yen , et al. May 3, 2	2022-05-03
Semiconductor device including metal holder and method of manufacturing the same Grant 11,322,468 - Yen , et al. May 3, 2	2022-05-03
Electronic Package And Method For Manufacturing The Same App 20220115328 - YEN; You-Lung ; et al.	2022-04-14
Substrate Structure, Semiconductor Package Structure And Method For Manufacturing A Substrate Structure App 20220115288 - YEN; You-Lung ; et al.	2022-04-14
Electronic Package And Method For Manufacturing The Same App 20220115310 - YEN; You-Lung ; et al.	2022-04-14
Semiconductor package and method of manufacturing the same Grant 11,282,777 - Yen , et al. March 22, 2	2022-03-22
Semiconductor Device Package And Method For Manufacturing The Same App 20220037290 - YEN; You-Lung ; et al.	2022-02-03
Semiconductor Device And Method Of Manufacturing The Same App 20210335742 - YEN; You-Lung ; et al.	2021-10-28
Package Structure And Method For Manufacturing The Same App 20210327841 - YEN; You-Lung ; et al.	2021-10-21
Semiconductor device package and method for manufacturing the same Grant 11,145,624 - Yen , et al. October 12, 2	2021-10-12
Semiconductor Package And Manufacturing Process App 20210225746 - APPELT; Bernd Karl ; et al.	2021-07-22
Semiconductor Package And Method Of Manufacturing The Same App 20210202362 - YEN; You-Lung ; et al.	2021-07-01
Semiconductor Device Packages And Method Of Manufacturing The Same App 20210183787 - YEN; You-Lung ; et al.	2021-06-17
Semiconductor Device Package And Method Of Manufacturing The Same App 20210166993 - YEN; You-Lung ; et al.	2021-06-03
Semiconductor Device Package And Method Of Manufacturing The Same App 20210118775 - YEN; You-Lung ; et al.	2021-04-22
Semiconductor device package and method of manufacturing the same Grant 10,978,312 - Yen , et al. April 13, 2	2021-04-13
Semiconductor Device Package And Method For Manufacturing The Same App 20210028150 - YEN; You-Lung ; et al.	2021-01-28
Semiconductor Device Package And Method Of Manufacturing The Same App 20200350180 - YEN; You-Lung ; et al.	2020-11-05
Semiconductor package device for power device Grant 10,777,478 - Appelt , et al. Sept	2020-09-15
Semiconductor Package And Manufacturing Process App 20190363039 - APPELT; Bernd Karl ; et al.	2019-11-28
Semiconductor Package Structure And Method Of Manufacturing The Same App 20190279924 - APPELT; Bernd Karl ; et al.	2019-09-12
Semiconductor Package And Method Of Manufacturing The Same App 20190088506 - APPELT; Bernd Karl ; et al.	2019-03-21
Semiconductor package and method for manufacturing a semiconductor package Grant 10,229,892 - Appelt	2019-03-12
Semiconductor package and semiconductor process Grant 10,217,728 - Appelt , et al. Feb	2019-02-26
Semiconductor package device and method of manufacturing the same Grant 10,186,467 - Appelt , et al. Ja	2019-01-22
Semiconductor Package And Method For Manufacturing A Semiconductor Package App 20190006308 - APPELT; Bernd Karl	2019-01-03
Semiconductor Package And Semiconductor Process App 20180145060 - APPELT; Bernd Karl ; et al.	2018-05-24
Semiconductor Package Device And Method Of Manufacturing The Same App 20180019221 - APPELT; Bernd Karl ; et al.	2018-01-18
Semiconductor Package Device And Method Of Manufacturing The Same App 20180019175 - APPELT; Bernd Karl ; et al.	2018-01-18
Semiconductor Package And Method Of Manufacturing The Same App 20160218021 - APPELT; Bernd Karl ; et al.	2016-07-28
Semiconductor package with single sided substrate design and manufacturing methods thereof Grant 9,196,597 - Su , et al. November 24, 2	2015-11-24
Semiconductor Package With Single Sided Substrate Design And Manufacturing Methods Thereof App 20140346670 - Su; Yuan-Chang ; et al.	2014-11-27
Semiconductor package with single sided substrate design and manufacturing methods thereof Grant 8,884,424 - Su , et al. November 11, 2	2014-11-11
Semiconductor Package With Single Sided Substrate Design And Manufacturing Methods Thereof App 20140021636 - Su; Yuan-Chang ; et al.	2014-01-23
Semiconductor package with single sided substrate design and manufacturing methods thereof Grant 8,569,894 - Su , et al. October 29, 2	2013-10-29
Semiconductor package with embedded die and manufacturing methods thereof Grant 8,487,426 - Essig , et al. July 16, 2	2013-07-16
Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package Grant 8,399,776 - Appelt , et al. March 19, 2	2013-03-19
Semiconductor package Grant 8,330,267 - Chen , et al. December 11, 2	2012-12-11
Leadframe package structure and manufacturing method thereof Grant 8,309,400 - Appelt , et al. November 13, 2	2012-11-13
Embedded component substrate, semiconductor package structure using the same and fabrication methods thereof Grant 8,304,878 - Appelt November 6, 2	2012-11-06
Semiconductor Device Packages And Related Methods App 20120261689 - Appelt; Bernd Karl ; et al.	2012-10-18
Semiconductor package with substrate having single metal layer and manufacturing methods thereof Grant 8,288,869 - Huang , et al. October 16, 2	2012-10-16
Embedded component package structure Grant 8,284,561 - Su , et al. October 9, 2	2012-10-09
Semiconductor Package with Embedded Die and Manufacturing Methods Thereof App 20120235309 - Essig; Kay Stephan ; et al.	2012-09-20
Leadframe Package Structure And Manufacturing Method Thereof App 20120091569 - Appelt; Bernd Karl ; et al.	2012-04-19
Multi-layered Substrate App 20120073871 - Appelt; Bernd Karl ; et al.	2012-03-29
Method Of Fabricating Embedded Component Package Structure And The Package Structure Thereof App 20120033394 - Su; Yuan-Chang ; et al.	2012-02-09
Method of fabricating multi-layered substrate Grant 8,104,171 - Appelt , et al. January 31, 2	2012-01-31
Embedded Component Substrate, Semiconductor Package Structure Using The Same And Fabrication Methods Thereof App 20110278713 - Appelt; Bernd Karl	2011-11-17
Semiconductor Package with Single Sided Substrate Design and Manufacturing Methods Thereof App 20110169150 - Su; Yuan-Chang ; et al.	2011-07-14
Semiconductor Package App 20110057301 - Chen; Kuang-Hsiung ; et al.	2011-03-10
Semiconductor Package With Substrate Having Single Metal Layer And Manufacturing Methods Thereof App 20100320610 - HUANG; SHIH-FU ; et al.	2010-12-23
Substrate Having Single Patterned Metal Layer, And Package Applied With The Substrate , And Methods Of Manufacturing Of The Substrate And Package App 20100288541 - APPELT; Bernd Karl ; et al.	2010-11-18
Chip Scale Package Structure And Fabrication Method Thereof App 20100052156 - Appelt; Bernd Karl ; et al.	2010-03-04
Method Of Fabricating Multi-layered Substrate And The Substrate Thereof App 20100055392 - Appelt; Bernd Karl ; et al.	2010-03-04
Wire Bodning Package Structure App 20100052122 - Appelt; Bernd Karl	2010-03-04
Stacked Type Chip Package Structure App 20100052186 - Appelt; Bernd Karl ; et al.	2010-03-04
Method for manufacturing an adhesive substrate with a die-cavity sidewall Grant 7,417,313 - Appelt , et al. August 26, 2	2008-08-26
Method for manufacturing a semiconductor package with a laminated chip cavity Grant 7,344,915 - Appelt , et al. March 18, 2	2008-03-18
Overmolded Optical Package App 20070166866 - APPELT; Bernd Karl ; et al.	2007-07-19
Overmolded optical package Grant 7,199,438 - Appelt , et al. April 3, 2	2007-04-03
Method for manufacturing an adhesive substrate with a die-cavity sidewall App 20070065989 - Appelt; Bernd Karl ; et al.	2007-03-22
Method for manufacturing an adhesive substrate with a die-cavity sidewall Grant 7,172,926 - Appelt , et al. February 6, 2	2007-02-06
Method for manufacturing a semiconductor package with a laminated chip cavity App 20060205119 - Appelt; Bernd Karl ; et al.	2006-09-14
Method for manufacturing an adhesive substrate with a die-cavity sidewall App 20050239235 - Appelt, Bernd Karl ; et al.	2005-10-27
Overmolded optical package App 20050073036 - Appelt, Bernd Karl ; et al.	2005-04-07
Die attachment with reduced adhesive bleed-out Grant 6,734,569 - Appelt , et al. May 11, 2	2004-05-11
Die attachment with reduced adhesive bleed-out App 20030119226 - Appelt, Bernd Karl ; et al.	2003-06-26
Process for filling apertures in a circuit board or chip carrier App 20010008747 - Appelt, Bernd Karl ; et al.	2001-07-19
Method of filling an aperture in a substrate Grant 6,114,098 - Appelt , et al. September 5, 2	2000-09-05
Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing Grant 6,096,665 - Appelt , et al. August 1, 2	2000-08-01
Dustfree prepreg and method for making an article based thereon Grant 5,928,970 - Appelt , et al. July 27, 1	1999-07-27
Technique for forming resin-impregnated fiberglass sheets using multiple resins Grant 5,919,525 - Appelt , et al. July 6, 1	1999-07-06
Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing Grant 5,858,461 - Appelt , et al. January 12, 1	1999-01-12
Technique for forming resin-impregnated fiberglass sheets Grant 5,773,371 - Appelt , et al. June 30, 1	1998-06-30
Technique for forming resin-impregnated fiberglass sheets Grant 5,756,405 - Appelt , et al. May 26, 1	1998-05-26

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