Apale; Hermes T.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Apale; Hermes T..The latest application filed is for "semiconductor device package".

Company Profile

0.6.6

Apale; Hermes T. - Shrewsbury MA
Apale; Hermes T. - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device package Grant 6,960,493 - Ararao , et al. November 1, 2	2005-11-01
Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the same Grant 6,875,634 - Shim , et al. April 5, 2	2005-04-05
Semiconductor device package App 20050006668 - Ararao, Virgil C. ; et al.	2005-01-13
Mold cap anchoring method for molded flex BGA packages Grant 6,825,067 - Ararao , et al. November 30, 2	2004-11-30
Heat spreader interconnect for thermally enhanced PBGA packages Grant 6,818,981 - Shim , et al. November 16, 2	2004-11-16
Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the same App 20040180525 - Shim, Il Kwon ; et al.	2004-09-16
Heat spreader interconnect for thermally enhanced PBGA packages App 20040155338 - Shim, Il Kwon ; et al.	2004-08-12
Mold cap anchoring method for molded flex BGA packages App 20040108601 - Ararao, Virgil C. ; et al.	2004-06-10
Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same Grant 6,737,298 - Shim , et al. May 18, 2	2004-05-18
Heat spreader interconnect methodology for thermally enhanced PBGA packages Grant 6,706,563 - Shim , et al. March 16, 2	2004-03-16
Heat spreader interconnect methodology for thermally enhanced PBGA packages App 20030197195 - Shim, Il Kwon ; et al.	2003-10-23
Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same App 20030138994 - Shim, Il Kwon ; et al.	2003-07-24

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