| Patent | Date |
|---|
Wafer-fixing tape, method of processing a semiconductor wafer, and semiconductor chip
Grant 10,699,933 - Oka , et al. | 2020-06-30 |
Conductive adhesive composition
Grant 10,563,096 - Aoyama , et al. Feb | 2020-02-18 |
Method of processing a semiconductor wafer, semiconductor chip, and surface protective tape
Grant 10,418,267 - Oka , et al. Sept | 2019-09-17 |
Resin composition for sealing electronic device, and electronic device
Grant 10,196,534 - Asanuma , et al. Fe | 2019-02-05 |
Resin composition for sealing electronic device, and electronic device
Grant 10,196,547 - Aoyama , et al. Fe | 2019-02-05 |
Adhesive film and semiconductor package using adhesive film
Grant 10,115,707 - Kirikae , et al. October 30, 2 | 2018-10-30 |
Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display device
Grant 10,043,996 - Aoyama , et al. August 7, 2 | 2018-08-07 |
Film For Semiconductor Back Surface
App 20180190532 - SUGIYAMA; Jirou ; et al. | 2018-07-05 |
Method Of Processing A Semiconductor Wafer, Semiconductor Chip, And Surface Protective Tape
App 20180012787 - OKA; Yoshifumi ; et al. | 2018-01-11 |
Wafer-fixing Tape, Method Of Processing A Semiconductor Wafer, And Semiconductor Chip
App 20180012788 - OKA; Yoshifumi ; et al. | 2018-01-11 |
Transparent resin composition for sealing organic electroluminescence element, resin sheet for sealing organic electroluminescence element, and apparatus for displaying image
Grant 9,758,690 - Ishiguro , et al. September 12, 2 | 2017-09-12 |
Adhesive Film
App 20170152405 - AOYAMA; Masami ; et al. | 2017-06-01 |
Conductive Adhesive Composition
App 20170152410 - AOYAMA; Masami ; et al. | 2017-06-01 |
Maleimide Film
App 20170152418 - AOYAMA; Masami ; et al. | 2017-06-01 |
Conductive Adhesive Film
App 20170152411 - MIHARA; Naoaki ; et al. | 2017-06-01 |
Adhesive Film And Semiconductor Package Using Adhesive Film
App 20170152408 - KIRIKAE; Noriyuki ; et al. | 2017-06-01 |
Adhesive sheet
Grant 9,631,123 - Aoyama , et al. April 25, 2 | 2017-04-25 |
Adhesive sheet
Grant 9,523,023 - Aoyama , et al. December 20, 2 | 2016-12-20 |
Resin Composition For Sealing Electronic Device, And Electronic Device
App 20160362587 - AOYAMA; Masami ; et al. | 2016-12-15 |
Resin Composition For Sealing Electronic Device, And Electronic Device
App 20160362576 - ASANUMA; Takumi ; et al. | 2016-12-15 |
Element Sealing Resin Composition For Organic Electronic Device, Element Sealing Resin Sheet For Organic Electronic Device, Organic Electroluminescence Element, And Image Display
App 20160017197 - MIEDA; Tetsuya ; et al. | 2016-01-21 |
Sealant Composition And Sealing Sheet Obtained From The Composition
App 20160017186 - AOYAMA; Masami ; et al. | 2016-01-21 |
Resin Composition For Element Encapsulation For Organic Electronic Devices, Resin Sheet For Element Encapsulation For Organic Electronic Devices, Organic Electroluminescent Element, And Image Display Device
App 20160020426 - AOYAMA; Masami ; et al. | 2016-01-21 |
Resin Composition For Element Encapsulation For Organic Electronic Devices, Resin Sheet For Element Encapsulation For Organic Electronic Devices, Organic Electroluminescent Element, And Image Display Device
App 20160020423 - SAITO; Keiji ; et al. | 2016-01-21 |
Transparent Resin Composition For Sealing Organic Electroluminescence Element, Resin Sheet For Sealing Organic Electroluminescence Element, And Apparatus For Displaying Image
App 20150291824 - ISHIGURO; Kunihiko ; et al. | 2015-10-15 |
Adhesive Sheet
App 20150017375 - AOYAMA; Masami ; et al. | 2015-01-15 |
Adhesive Sheet
App 20150017374 - AOYAMA; Masami ; et al. | 2015-01-15 |
Adhesive Sheet
App 20150017373 - AOYAMA; Masami ; et al. | 2015-01-15 |
Dicing Die Bonding Film Packing Structure And Packing Method
App 20140034532 - AOYAMA; Masami | 2014-02-06 |
| 