loadpatents
name:-0.00091099739074707
name:-0.017091989517212
name:-0.00050187110900879
Aoyama; Masaharu Patent Filings

Aoyama; Masaharu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Aoyama; Masaharu.The latest application filed is for "method of forming trench buried wiring for semiconductor device".

Company Profile
0.15.0
  • Aoyama; Masaharu - Fujisawa JP
  • Aoyama; Masaharu - Yokohama JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of forming trench buried wiring for semiconductor device
Grant 5,266,526 - Aoyama , et al. November 30, 1
1993-11-30
Semiconductor device having insulating layer including polyimide film
Grant 4,853,760 - Abe , et al. August 1, 1
1989-08-01
Method of gettering a semiconductor device and forming an isolation region therein
Grant 4,766,086 - Ohshima , et al. August 23, 1
1988-08-23
Method of making multilayered interconnects using hillock studs formed by sintering
Grant 4,728,627 - Mase , et al. March 1, 1
1988-03-01
Method of manufacturing a semiconductor device with conductive trench sidewalls
Grant 4,717,682 - Taka , et al. January 5, 1
1988-01-05
Semiconductor device with an improved bonding section
Grant 4,636,832 - Abe , et al. January 13, 1
1987-01-13
Method for planarizing the surface of an interlayer insulating film in a semiconductor device
Grant 4,634,496 - Mase , et al. January 6, 1
1987-01-06
Semiconductor device having a multilayer wiring structure using a polyimide resin
Grant 4,618,878 - Aoyama , et al. October 21, 1
1986-10-21
Semiconductor device of multilayer wiring structure
Grant 4,613,888 - Mase , et al. September 23, 1
1986-09-23
Semiconductor device
Grant 4,561,009 - Yonezawa , et al. December 24, 1
1985-12-24
Method for forming metallization structure having flat surface on semiconductor substrate
Grant 4,520,041 - Aoyama , et al. May 28, 1
1985-05-28
Semiconductor memory device
Grant 4,507,673 - Aoyama , et al. March 26, 1
1985-03-26
System for etching a metal film on a semiconductor wafer
Grant 4,462,856 - Abe , et al. July 31, 1
1984-07-31
Method of manufacturing a semiconductor device
Grant 4,403,392 - Oshima , et al. September 13, 1
1983-09-13
Method of producing semiconductor device
Grant 4,334,349 - Aoyama , et al. June 15, 1
1982-06-15

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