Aoyama; Haruo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Aoyama; Haruo.The latest application filed is for "sn-zn lead-free solder alloy, its mixture, and soldered bond".
- Aoyama; Haruo - Sagamihara JP
- Aoyama; Haruo - Sagamihara-shi JP
- Aoyama, Haruo - Kanagawa JP
| Patent | Date |
|---|---|
| Sn--Zn lead-free solder alloy, its mixture, and soldered bond Grant 7,179,417 - Yoshikawa , et al. February 20, 2 | 2007-02-20 |
| Tin-zinc lead-free solder, its mixture, and solder-joined part Grant 7,175,805 - Yoshikawa , et al. February 13, 2 | 2007-02-13 |
| Sn-Zn lead-free solder alloy, and solder junction portion Grant 7,175,804 - Yoshikawa , et al. February 13, 2 | 2007-02-13 |
| Sn-zn Lead-free Solder Alloy, Its Mixture, And Soldered Bond App 20060210420 - Yoshikawa; Masaaki ; et al. | 2006-09-21 |
| Sn-zn Lead-free Solder Alloy, And Solder Junction Portion App 20060204397 - Yoshikawa; Masaaki ; et al. | 2006-09-14 |
| Sn-Zn lead-free solder alloy and soldered bond Grant 7,070,736 - Yoshikawa , et al. July 4, 2 | 2006-07-04 |
| Tin-zinc lead-free solder and solder-joined part App 20040156740 - Yoshikawa, Masaaki ; et al. | 2004-08-12 |
| Tin-zinc lead-free solder, its mixture, and solder-joined part App 20040156741 - Yoshikawa, Masaaki ; et al. | 2004-08-12 |
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