Aoya; Kengo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Aoya; Kengo.The latest application filed is for "electronic package with surface contact wire extensions".
- Aoya; Kengo - Oita JP
- Aoya; Kengo - Beppu JP
- Aoya; Kengo - Beppu City JP
- Aoya; Kengo - Beppu Oita JP
- Aoya; Kengo - Hayami-Gun JP
- AOYA; KENGO - HIJI-MACHI JP
- Aoya; Kengo - Oita-ken JP
- Aoya; Kengo - Beppu-shi JP
| Patent | Date |
|---|---|
| Fan-out electronic device Grant 11,410,875 - Nguyen , et al. August 9, 2 | 2022-08-09 |
| IC package with half-bridge power module Grant 11,387,179 - Shibuya , et al. July 12, 2 | 2022-07-12 |
| Electronic Package With Surface Contact Wire Extensions App 20220208660 - Shibuya; Makoto ; et al. | 2022-06-30 |
| Semiconductor Device Having Tapered Metal Coated Sidewalls App 20220208689 - NOGUCHI; Tomoko ; et al. | 2022-06-30 |
| Embedded Die Packaging With Integrated Ceramic Substrate App 20220108955 - Kim; Woochan ; et al. | 2022-04-07 |
| Transformers With Separated Magnetic Members App 20220068556 - YAN; Yi ; et al. | 2022-03-03 |
| Embedded die packaging with integrated ceramic substrate Grant 11,183,460 - Kim , et al. November 23, 2 | 2021-11-23 |
| Stress buffer layer in embedded package Grant 11,183,441 - Kim , et al. November 23, 2 | 2021-11-23 |
| Embedded die package multichip module Grant 11,158,595 - Kim , et al. October 26, 2 | 2021-10-26 |
| Ic Package With Half-bridge Power Module App 20210175165 - SHIBUYA; MAKOTO ; et al. | 2021-06-10 |
| Frame Design In Embedded Die Package App 20210134729 - Kim; Woochan ; et al. | 2021-05-06 |
| Metal-covered Chip Scale Packages App 20210125959 - MATSUURA; Masamitsu ; et al. | 2021-04-29 |
| Semiconductor package with multilayer mold Grant 10,879,144 - Aoya , et al. December 29, 2 | 2020-12-29 |
| Stress Buffer Layer in Embedded Package App 20200203249 - Kim; Woochan ; et al. | 2020-06-25 |
| Fan-out Electronic Device App 20200203219 - Nguyen; Hau Thanh ; et al. | 2020-06-25 |
| Embedded Die Packaging With Integrated Ceramic Substrate App 20200091076 - Kim; Woochan ; et al. | 2020-03-19 |
| Stress buffer layer in embedded package Grant 10,580,715 - Kim , et al. | 2020-03-03 |
| Semiconductor Package With Multilayer Mold App 20200058570 - Aoya; Kengo ; et al. | 2020-02-20 |
| Stress Buffer Layer in Embedded Package App 20190385924 - Kim; Woochan ; et al. | 2019-12-19 |
| Embedded Die Package Multichip Module App 20190013288 - KIM; WOOCHAN ; et al. | 2019-01-10 |
| Dual Sided Embedded Die And Fabrication Of Same Background App 20160240392 - Poddar; Anindya ; et al. | 2016-08-18 |
| Dual Sided Embedded Die And Fabrication Of Same Background App 20150147845 - Poddar; Anindya ; et al. | 2015-05-28 |
| Method And Structure Of Panelized Packaging Of Semiconductor Devices App 20150008566 - Gerber; Mark A. ; et al. | 2015-01-08 |
| Multi-step sintering of metal paste for semiconductor device wire bonding Grant 8,815,648 - Aoya , et al. August 26, 2 | 2014-08-26 |
| Micro-ball loading device and loading method Grant 8,434,664 - Aoya May 7, 2 | 2013-05-07 |
| Electronic Assembly Having Mixed Interface Including Tsv Die App 20130082383 - AOYA; KENGO | 2013-04-04 |
| Protruding TSV tips for enhanced heat dissipation for IC devices Grant 8,294,261 - Mawatari , et al. October 23, 2 | 2012-10-23 |
| Protruding Tsv Tips For Enhanced Heat Dissipation For Ic Devices App 20110186990 - Mawatari; Kazuaki ; et al. | 2011-08-04 |
| Transfer mask in micro ball mounter Grant 7,882,625 - Aoya February 8, 2 | 2011-02-08 |
| Micro Ball Feeding Method App 20100207273 - Aoya; Kengo | 2010-08-19 |
| Micro-ball Loading Device And Loading Method App 20090001132 - Aoya; Kengo | 2009-01-01 |
| Transfer Mask In Micro Ball Mounter App 20080196226 - Aoya; Kengo | 2008-08-21 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 