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Motor Driving Device, Method, And Program App 20180287525 - AOKI; Takayuki ;   et al. | 2018-10-04 |
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Method Of Production Of Langatate-based Single Crystal And Langatate-based Single Crystal App 20180245237 - TAKAHASHI; Ikuo ;   et al. | 2018-08-30 |
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Vehicular Display Device App 20170334293 - KAWAMOTO; Masashi ;   et al. | 2017-11-23 |
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Fuel Cell Module With Heat Exchanger App 20150050573 - Yoshimine; Yuki ;   et al. | 2015-02-19 |
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Vehicle instrument panel reinforcement and passenger seat airbag device attachment structure employing the vehicle instrument panel reinforcement Grant 8,814,206 - Aoki August 26, 2 | 2014-08-26 |
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Vehicle Instrument Panel Reinforcement And Passenger Seat Airbag Device Attachment Structure Employing The Vehicle Instrument Panel Reinforcement App 20140021707 - Aoki; Takayuki | 2014-01-23 |
Vehicle Instrument Panel Reinforcement App 20140001792 - Aoki; Takayuki ;   et al. | 2014-01-02 |
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Vehicle Steering Column Support Structure App 20130076016 - Aoki; Takayuki | 2013-03-28 |
Heat-expandable Microspheres And A Process For Producing The Same App 20130030065 - MASUDA; Toshiaki ;   et al. | 2013-01-31 |
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Bumblebee Nest Box App 20120295514 - Keppens; Willem Steven Paul ;   et al. | 2012-11-22 |
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Image processing apparatus, and image forming apparatus Grant 8,199,364 - Aoki June 12, 2 | 2012-06-12 |
Valve Spring Retainer For An Internal Combustion Engine And A Method Of Manufacturing The Same App 20120132841 - Aoki; Takayuki ;   et al. | 2012-05-31 |
Thermally Expanded Microspheres And A Process For Producing The Same App 20120121907 - MASUDA; Toshiaki ;   et al. | 2012-05-17 |
Heat-expandable Microspheres And Hollow Fine Particles And Method For Producing The Same As Well As Tire/rim Assembly App 20120080131 - TERATANI; Hiroyuki ;   et al. | 2012-04-05 |
Thermally expanded microspheres and a process for producing the same Grant 8,129,020 - Masuda , et al. March 6, 2 | 2012-03-06 |
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Control apparatus for internal combustion engine Grant 7,930,092 - Tokugawa , et al. April 19, 2 | 2011-04-19 |
Epoxy resin composition for encapsulating semiconductor devices and semiconductor devices encapsulated therewith Grant 7,898,094 - Osada , et al. March 1, 2 | 2011-03-01 |
Heat-expandable Microspheres And Hollow Fine Particles And Method For Producing The Same As Well As Tire/rim Assembly App 20100180995 - Teratani; Hiroyuki ;   et al. | 2010-07-22 |
Thermosetting Epoxy Resin Composition And Semiconductor Device App 20100104794 - Aoki; Takayuki ;   et al. | 2010-04-29 |
Engine-driven Power Generator Apparatus App 20090320772 - Hirose; Tadafumi ;   et al. | 2009-12-31 |
Engine Generator App 20090322046 - Hirose; Tadafumi ;   et al. | 2009-12-31 |
Thermally Expanded Microspheres And A Process For Producing The Same App 20090280328 - Masuda; Toshiaki ;   et al. | 2009-11-12 |
Heat-expandable Microspheres And A Process For Producing The Same App 20090176098 - Masuda; Toshiaki ;   et al. | 2009-07-09 |
Heat-expandable Microspheres, Method For Producing The Same, And Application Thereof App 20090149559 - Masuda; Toshiaki ;   et al. | 2009-06-11 |
Control Apparatus For Internal Combustion Engine App 20090063014 - TOKUGAWA; Kazuhito ;   et al. | 2009-03-05 |
Image Processing Apparatus, And Image Forming Apparatus App 20080278763 - Aoki; Takayuki | 2008-11-13 |
Thermosetting Epoxy Resin Composition And Semiconductor Device App 20080255283 - Aoki; Takayuki ;   et al. | 2008-10-16 |
Epoxy resin composition for encapsulating semiconductor devices and semiconductor devices encapsulated therewith App 20070179259 - Osada; Shoichi ;   et al. | 2007-08-02 |
Epoxy resin composition and semiconductor device App 20070029682 - Aoki; Takayuki ;   et al. | 2007-02-08 |
Semiconductor encapsulating epoxy resin composition and semiconductor device App 20060216519 - Kimura; Yasuo ;   et al. | 2006-09-28 |
Container for storing molten metal Grant D529,058 - Aoki , et al. September 26, 2 | 2006-09-26 |
Container for storing molten metal Grant D528,573 - Aoki , et al. September 19, 2 | 2006-09-19 |
Semiconductor encapsulating epoxy resin composition and semiconductor device Grant 7,095,125 - Osada , et al. August 22, 2 | 2006-08-22 |
Semiconductor encapsulating epoxy resin composition and semiconductor device Grant 6,894,091 - Osada , et al. May 17, 2 | 2005-05-17 |
Ironing dies Grant 6,860,134 - Miyauchi , et al. March 1, 2 | 2005-03-01 |
Ironing-deep drawing process Grant 6,755,068 - Miyauchi , et al. June 29, 2 | 2004-06-29 |
Semiconductor encapsulating epoxy resin composition and semiconductor device Grant 6,723,452 - Kimura , et al. April 20, 2 | 2004-04-20 |
Method and apparatus for measuring angle of bend, method of bending, and apparatus for controlling angle of bend Grant 6,708,541 - Matsumoto , et al. March 23, 2 | 2004-03-23 |
Semiconductor encapsulating epoxy resin composition and semiconductor device App 20040034161 - Osada, Shoichi ;   et al. | 2004-02-19 |
Semiconductor encapsulating epoxy resin composition and semiconductor device Grant 6,630,745 - Osada , et al. October 7, 2 | 2003-10-07 |
Semiconductor encapsulating epoxy resin composition and semiconductor device App 20030050399 - Kimura, Yasuo ;   et al. | 2003-03-13 |
Ironing dies App 20020083755 - Miyauchi, Kunio ;   et al. | 2002-07-04 |
Ironing-deep drawing process App 20020083754 - Miyauchi, Kunio ;   et al. | 2002-07-04 |
Semiconductor encapsulating epoxy resin composition and semiconductor device App 20020016398 - Osada, Shoichi ;   et al. | 2002-02-07 |
Semiconductor encapsulating epoxy resin composition and semiconductor device Grant 6,291,556 - Osada , et al. September 18, 2 | 2001-09-18 |
Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith Grant 6,221,509 - Hirano , et al. April 24, 2 | 2001-04-24 |
Semiconductor encapsulating epoxy resin composition and semiconductor device Grant 6,162,878 - Osada , et al. December 19, 2 | 2000-12-19 |
Encapsulant of crystalline epoxy resin and phenolic resin-crystalline epoxy resin reaction product Grant 6,027,812 - Shiobara , et al. February 22, 2 | 2000-02-22 |
Nitride layer for discharge lamps Grant 5,668,440 - Inukai , et al. September 16, 1 | 1997-09-16 |
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Naphthalene containing epoxy resin cured with a dicyclopentadiene phenolic resin Grant 5,312,878 - Shiobara , et al. May 17, 1 | 1994-05-17 |
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Epoxy resin compositions and cured products thereof Grant 5,225,484 - Shiobara , et al. July 6, 1 | 1993-07-06 |
Epoxy resin compositions containing polysubstituted novolac epoxy resins and naphthylene based phenolic resin curing agents and semiconductor devices encapsulated therewith Grant 5,166,228 - Shiobara , et al. November 24, 1 | 1992-11-24 |
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