Aoki; Riichirou

Patent Applications and Registrations

Patent applications and USPTO patent grants for Aoki; Riichirou.The latest application filed is for "method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device".

Company Profile

0.14.7

Aoki; Riichirou - Tokyo JP
Aoki; Riichirou - Kawasaki JP
Aoki; Riichirou - Kitakami JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device App 20080090501 - Okumura; Katsuya ; et al.	2008-04-17
Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device App 20060009130 - Okumura; Katsuya ; et al.	2006-01-12
Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device Grant 6,966,821 - Okumura , et al. November 22, 2	2005-11-22
Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device App 20030148714 - Okumura, Katsuya ; et al.	2003-08-07
Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device Grant 6,443,808 - Okumura , et al. September 3, 2	2002-09-03
Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device App 20010014572 - Okumura, Katsuya ; et al.	2001-08-16
Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device Grant 6,273,802 - Okumura , et al. August 14, 2	2001-08-14
Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device App 20010010996 - Okumura, Katsuya ; et al.	2001-08-02
Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device App 20010010997 - Okumura, Katsuya ; et al.	2001-08-02
Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device App 20010011000 - Okumura, Katsuya ; et al.	2001-08-02
Polishing apparatus and method for planarizing layer on a semiconductor wafer Grant 5,948,205 - Kodera , et al. September 7, 1	1999-09-07
Polishing apparatus and method for planarizing layer on a semiconductor wafer Grant 5,914,275 - Kodera , et al. June 22, 1	1999-06-22
Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device Grant 5,885,138 - Okumura , et al. March 23, 1	1999-03-23
Method for planarizing a semiconductor body by CMP method and an apparatus for manufacturing a semiconductor device using the method Grant 5,695,601 - Kodera , et al. December 9, 1	1997-12-09
Polishing apparatus Grant 5,616,063 - Okumura , et al. April 1, 1	1997-04-01
Semiconductor planarizing apparatus Grant 5,597,341 - Kodera , et al. January 28, 1	1997-01-28
Method for forming silicon oxide on a semiconductor Grant 5,571,578 - Kaji , et al. November 5, 1	1996-11-05
Method for planarizing a semiconductor device having a amorphous layer Grant 5,445,996 - Kodera , et al. August 29, 1	1995-08-29
Method of manufacturing silicon oxide film containing fluorine Grant 5,429,995 - Nishiyama , et al. July 4, 1	1995-07-04
Method and apparatus for polishing a workpiece Grant 5,398,459 - Okumura , et al. March 21, 1	1995-03-21
Semiconductor device and method of manufacturing the same Grant 4,937,652 - Okumura , et al. June 26, 1	1990-06-26

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