Anzai; Noritaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Anzai; Noritaka.The latest application filed is for "semiconductor apparatus with decoupling capacitor".

Company Profile

0.19.18

Anzai; Noritaka - Tokyo JP
Anzai; Noritaka - Kanagawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor apparatus with decoupling capacitor Grant 8,018,055 - Terui , et al. September 13, 2	2011-09-13
Semiconductor apparatus with decoupling capacitor App 20100207244 - Terui; Makoto ; et al.	2010-08-19
Semiconductor apparatus with decoupling capacitor Grant 7,714,434 - Terui , et al. May 11, 2	2010-05-11
Semiconductor device and method of producing the same Grant 7,616,167 - Anzai November 10, 2	2009-11-10
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements Grant 7,545,036 - Terui , et al. June 9, 2	2009-06-09
Semiconductor device with signal line having decreased characteristic impedance Grant 7,538,417 - Anzai May 26, 2	2009-05-26
Semiconductor apparatus with decoupling capacitor App 20090096063 - Terui; Makoto ; et al.	2009-04-16
Semiconductor device and method for fabricating the same Grant 7,511,351 - Anzai , et al. March 31, 2	2009-03-31
Semiconductor apparatus with decoupling capacitor Grant 7,459,765 - Terui , et al. December 2, 2	2008-12-02
Semiconductor apparatus with decoupling capacitor App 20070296069 - Terui; Makoto ; et al.	2007-12-27
Semiconductor device and method of producing the same App 20070236393 - Anzai; Noritaka	2007-10-11
Semiconductor device with signal line having decreased characteristic impedance App 20070187824 - Anzai; Noritaka	2007-08-16
Semiconductor device with signal line having decreased characteristic impedance Grant 7,239,028 - Anzai July 3, 2	2007-07-03
Semiconductor apparatus with decoupling capacitor Grant 7,173,335 - Terui , et al. February 6, 2	2007-02-06
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements App 20070021089 - Terui; Makoto ; et al.	2007-01-25
Semiconductor device and method for fabricating the same Grant 7,026,699 - Anzai , et al. April 11, 2	2006-04-11
Semiconductor device which includes an inductor therein and a manufacturing method thereof App 20060038257 - Anzai; Noritaka	2006-02-23
Semiconductor device App 20060022354 - Anzai; Noritaka	2006-02-02
Semiconductor device with signal line having decreased characteristic impedance Grant 6,982,494 - Anzai January 3, 2	2006-01-03
Semiconductor device and method for fabricating the same App 20050263847 - Anzai, Noritaka ; et al.	2005-12-01
Resin-molded semiconductor device that includes at least one additional electronic part Grant 6,833,607 - Anzai , et al. December 21, 2	2004-12-21
Semiconductor device and method for fabricating the same App 20040238929 - Anzai, Noritaka ; et al.	2004-12-02
Semiconductor apparatus with decoupling capacitor Grant 6,806,564 - Terui , et al. October 19, 2	2004-10-19
Semiconductor apparatus with decoupling capacitor App 20040145041 - Terui, Makoto ; et al.	2004-07-29
Semiconductor apparatus with decoupling capacitor Grant 6,707,146 - Terui , et al. March 16, 2	2004-03-16
Semiconductor device App 20040026782 - Anzai, Noritaka	2004-02-12
Semiconductor device App 20030205808 - Terui, Makoto ; et al.	2003-11-06
Semiconductor device App 20030189251 - Terui, Makoto ; et al.	2003-10-09
Semiconductor apparatus with decoupling capacitor Grant 6,608,375 - Terui , et al. August 19, 2	2003-08-19
Resin-molded semiconductor device App 20030102543 - Anzai, Noritaka ; et al.	2003-06-05
Semiconductor apparatus with decoupling capacitor App 20020195705 - Terui, Makoto ; et al.	2002-12-26
Semiconductor apparatus with decoupling capacitor App 20020145180 - Terui, Makoto ; et al.	2002-10-10
Resin-sealed semiconductor device and method of manufacturing the device App 20020000676 - Ohuchi, Shinji ; et al.	2002-01-03
Resin sealed-type semiconductor device and method of manufacturing the same Grant 6,323,551 - Anzai November 27, 2	2001-11-27
Bond pad for stress releif between a substrate and an external substrate Grant 6,259,163 - Ohuchi , et al. July 10, 2	2001-07-10
Method of manufacturing semiconductor devices having solder bumps with reduced cracks Grant 6,251,704 - Ohuchi , et al. June 26, 2	2001-06-26
Resin sealing type semiconductor device Grant 5,999,413 - Ohuchi , et al. December 7, 1	1999-12-07

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