ANZAI; Kazuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for ANZAI; Kazuo.The latest application filed is for "method of purging for an injection molding machine".

Company Profile

0.12.6

ANZAI; Kazuo - Hanishina-gun JP
Anzai; Kazuo - Nagano-ken JP
Anzai; Kazuo - Worcester MA
Anzai; Kazuo - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method Of Purging For An Injection Molding Machine App 20150328812 - KOZUKA; Makoto ; et al.	2015-11-19
Method for manufacturing a composite of carbon nanomaterial and metallic material Grant 7,837,811 - Motegi , et al. November 23, 2	2010-11-23
Method for manufacturing a composite of carbon nanomaterial and metallic material App 20080127777 - Motegi; Tetsuichi ; et al.	2008-06-05
Method for melting metallic raw material in metal molding apparatus Grant 7,331,372 - Takizawa , et al. February 19, 2	2008-02-19
Melting and feeding method and apparatus of metallic material in metal molding machine Grant 7,165,599 - Takizawa , et al. January 23, 2	2007-01-23
Method for melting metallic raw material in metal molding apparatus App 20060243414 - Takizawa; Kiyoto ; et al.	2006-11-02
Method of molding low melting point metal alloy Grant 7,036,551 - Anzai , et al. May 2, 2	2006-05-02
Method of molding low melting point metal alloy Grant 7,032,640 - Anzai , et al. April 25, 2	2006-04-25
Method of molding low melting point metal alloy App 20050194117 - Anzai, Kazuo ; et al.	2005-09-08
Method of molding low melting point metal alloy App 20050194116 - Anzai, Kazuo ; et al.	2005-09-08
Melting and feeding method and apparatus of metallic material in metal molding machine App 20040182537 - Takizawa, Kiyoto ; et al.	2004-09-23
Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it Grant 5,063,121 - Sato , et al. November 5, 1	1991-11-05
Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it Grant 4,883,704 - Sato , et al. November 28, 1	1989-11-28
Aluminum nitride sintered body and preparation thereof Grant 4,883,780 - Kasori , et al. November 28, 1	1989-11-28
Aluminum nitride-based sintered body of high thermal conductivity Grant 4,766,097 - Shinozaki , et al. August 23, 1	1988-08-23
Aluminum nitride sintered body and process for producing the same Grant 4,746,637 - Kasori , et al. May 24, 1	1988-05-24
Aluminum nitride sintered body Grant 4,698,320 - Kasori , et al. October 6, 1	1987-10-06
Circuit substrate having high thermal conductivity Grant 4,659,611 - Iwase , et al. April 21, 1	1987-04-21

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