Antoniswamy; Aravindha R.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Antoniswamy; Aravindha R..The latest application filed is for "filled liquid metal thermal interface materials".
- Antoniswamy; Aravindha R. - Phoenix AZ
- Antoniswamy; Aravindha R. - Chandler AZ
| Patent | Date |
|---|---|
| Filled Liquid Metal Thermal Interface Materials App 20210125896 - Arrington; Kyle J. ; et al. | 2021-04-29 |
| Heat spreaders with interlocked inserts Grant 10,969,840 - Antoniswamy , et al. April 6, 2 | 2021-04-06 |
| Variable-thickness Integrated Heat Spreader (ihs) App 20210028084 - Chan Arguedas; Sergio Antonio ; et al. | 2021-01-28 |
| Integrated Heat Spreader (ihs) With Solder Thermal Interface Material (stim) Bleed-out Restricting Feature App 20210020537 - Chan Arguedas; Sergio Antonio ; et al. | 2021-01-21 |
| Vented Lids For Integrated Circuit Packages App 20200402884 - Wan; Zhimin ; et al. | 2020-12-24 |
| Integrated heat spreader having electromagnetically-formed features Grant 10,763,188 - Antoniswamy , et al. Sep | 2020-09-01 |
| Liquid Thermal Interface Material In Electronic Packaging App 20200203254 - Dhane; Kedar ; et al. | 2020-06-25 |
| Heat spreaders with integrated preforms Grant 10,236,233 - Antoniswamy , et al. | 2019-03-19 |
| Heat Spreaders With Interlocked Inserts App 20190079567 - Antoniswamy; Aravindha R. ; et al. | 2019-03-14 |
| Swaging Process For Complex Integrated Heat Spreaders App 20190043778 - TANG; Zhizhong ; et al. | 2019-02-07 |
| Sintered Heat Spreaders With Inserts App 20190027379 - Hu; Wei ; et al. | 2019-01-24 |
| Heat Spreaders With Integrated Preforms App 20180012820 - Antoniswamy; Aravindha R. ; et al. | 2018-01-11 |
| Heat spreaders with integrated preforms Grant 9,799,584 - Antoniswamy , et al. October 24, 2 | 2017-10-24 |
| Integrated heat spreader having electromagnetically-formed features App 20170186628 - Antoniswamy; Aravindha R. ; et al. | 2017-06-29 |
| Heat Spreaders With Integrated Preforms App 20170141008 - Antoniswamy; Aravindha R. ; et al. | 2017-05-18 |
| Multi-component integrated heat spreader for multi-chip packages Grant 9,330,999 - Fitzgerald , et al. May 3, 2 | 2016-05-03 |
| Multi-component Integrated Heat Spreader For Multi-chip Packages App 20150357258 - Fitzgerald; Thomas J. ; et al. | 2015-12-10 |
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