Antoku; Yuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Antoku; Yuki.The latest application filed is for "palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereof".

Company Profile

4.6.11

Antoku; Yuki - Saga-ken JP
Antoku; Yuki - Saga JP
ANTOKU; Yuki - Kanzaki-gun JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the same Grant 11,456,271 - Chiba , et al. September 27, 2	2022-09-27
Gold-coated silver bonding wire and manufacturing method thereof, and semiconductor device and manufacturing method thereof Grant 11,289,442 - Antoku , et al. March 29, 2	2022-03-29
Noble metal-coated silver wire for ball bonding, and semiconductor device using noble metal-coated silver wire for ball bonding Grant 11,251,153 - Chiba , et al. February 15, 2	2022-02-15
Palladium-coated Copper Bonding Wire, Manufacturing Method Of Palladium-coated Copper Bonding Wire, Wire Bonding Structure Using The Same, Semiconductor Device And Manufacturing Method Thereof App 20220005781 - AMANO; Hiroyuki ; et al.	2022-01-06
Palladium-coated Copper Bonding Wire, Wire Bonding Structure, Semiconductor Device, And Manufacturing Method Of Semiconductor Device App 20210366867 - AMANO; Hiroyuki ; et al.	2021-11-25
Palladium-coated Copper Bonding Wire And Method For Manufacturing Same App 20210280553 - AMANO; Hiroyuki ; et al.	2021-09-09
Noble Metal-coated Silver Wire For Ball Bonding And Method For Producing The Same, And Semiconductor Device Using Noble Metal-coated Silver Wire For Ball Bonding And Method For Producing The Same App 20210050321 - CHIBA; Jun ; et al.	2021-02-18
Noble Metal-coated Silver Wire For Ball Bonding And Method For Producing The Same, And Semiconductor Device Using Noble Metal-coated Silver Wire For Ball Bonding And Method For Producing The Same App 20200395330 - CHIBA; Jun ; et al.	2020-12-17
Gold-coated Silver Bonding Wire And Manufacturing Method Thereof, And Semiconductor Device And Manufacturing Method Thereof App 20200350273 - ANTOKU; Yuki ; et al.	2020-11-05
Palladium (Pd)-coated copper wire for ball bonding Grant 10,195,697 - Amano , et al. Fe	2019-02-05
Bonding wire for high-speed signal line Grant 9,972,595 - Antoku , et al. May 15, 2	2018-05-15
Noble Metal-coated Copper Wire For Ball Bonding App 20170125135 - AMANO; Hiroyuki ; et al.	2017-05-04
Palladium (pd)-coated Copper Wire For Ball Bonding App 20170057020 - AMANO; Hiroyuki ; et al.	2017-03-02
Silver--gold alloy bonding wire Grant 9,362,249 - Yasuhara , et al. June 7, 2	2016-06-07
Silver-gold Alloy Bonding Wire App 20160093586 - YASUHARA; Kazuhiko ; et al.	2016-03-31
Bonding Wire For High-speed Signal Line App 20140302317 - ANTOKU; Yuki ; et al.	2014-10-09
Ag-Au-Pd TERNARY ALLOY BONDING WIRE App 20120263624 - Chiba; Jun ; et al.	2012-10-18

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