Antley; Richard L.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Antley; Richard L..The latest application filed is for "die testing using top surface test pads".

Company Profile

1.21.20

Antley; Richard L. - Richardson TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Die testing using top surface test pads Grant 10,809,295 - Whetsel , et al. October 20, 2	2020-10-20
Die Testing Using Top Surface Test Pads App 20200278389 - Whetsel; Lee D. ; et al.	2020-09-03
Enable input buffer coupling enable pad, functional circuitry, test circuit Grant 10,690,717 - Whetsel , et al.	2020-06-23
Test circuitry coupling test pad to functional core input pad Grant 10,281,522 - Whetsel , et al.	2019-05-07
Die Testing Using Top Surface Test Pads App 20180106858 - Whetsel; Lee D. ; et al.	2018-04-19
Improved Die Testing Using Top Surface Test Pads App 20170003341 - Whetsel; Lee D. ; et al.	2017-01-05
Die testing using top surface test pads Grant 9,472,478 - Whetsel , et al. October 18, 2	2016-10-18
Die Testing Using Top Surface Test Pads App 20160079132 - Whetsel; Lee D. ; et al.	2016-03-17
Die with separate functional input, test out, enable input buffers Grant 9,245,812 - Whetsel , et al. January 26, 2	2016-01-26
Die Testing Using Top Surface Test Pads App 20150097186 - Whetsel; Lee D. ; et al.	2015-04-09
Test output buffer functional output input, test output, enable input Grant 8,941,109 - Whetsel , et al. January 27, 2	2015-01-27
Die Testing Using Top Surface Test Pads App 20140225112 - Whetsel; Lee D. ; et al.	2014-08-14
Test circuitry coupled to embedded circuit input/output unconnected to pads Grant 8,742,415 - Whetsel , et al. June 3, 2	2014-06-03
Die Testing Using Top Surface Test Pads App 20130248864 - Whetsel; Lee D. ; et al.	2013-09-26
Test and enable circuitry connected between embedded die circuits Grant 8,466,464 - Whetsel , et al. June 18, 2	2013-06-18
Integrated circuit having electrically isolatable test circuitry Grant 8,230,284 - Antley , et al. July 24, 2	2012-07-24
Die Testing Using Top Surface Test Pads App 20120182033 - Whetsel; Lee D. ; et al.	2012-07-19
Die having embedded circuitry with test and test enable circuitry Grant 8,168,970 - Whetsel , et al. May 1, 2	2012-05-01
Integrated Circuit Having Electrically Isolatable Test Circuitry App 20120019280 - Antley; Richard L. ; et al.	2012-01-26
Testing IC functional and test circuitry having separate input/output pads Grant 8,055,962 - Antley , et al. November 8, 2	2011-11-08
Die Testing Using Top Surface Test Pads App 20110204915 - Whetsel; Lee D. ; et al.	2011-08-25
Test pads coupled with leads unconnected with die pads Grant 7,956,357 - Whetsel , et al. June 7, 2	2011-06-07
Integrated Circuit Having Electrically Isolatable Test Circuitry App 20110001503 - Antley; Richard L. ; et al.	2011-01-06
Connecting analog response to separate strobed comparator input on IC Grant 7,823,038 - Antley , et al. October 26, 2	2010-10-26
Integrated Circuit Having Electrically Isolatable Test Circuitry App 20090284267 - Antley; Richard L. ; et al.	2009-11-19
Die Testing Using Top Surface Test Pads App 20090261326 - Whetsel; Lee D. ; et al.	2009-10-22
Integrated circuit having electrically isolatable test circuitry Grant 7,587,648 - Antley , et al. September 8, 2	2009-09-08
Test pads on leads unconnected with die pads Grant 7,569,853 - Whetsel , et al. August 4, 2	2009-08-04
Integrated Circuit Having Electrically Isolatable Test Circuitry App 20080276145 - Antley; Richard L. ; et al.	2008-11-06
Integrated circuit having electrically isolatable test circuitry Grant 7,418,643 - Antley , et al. August 26, 2	2008-08-26
Die Testing Using Top Surface Test Pads App 20080157803 - Whetsel; Lee D. ; et al.	2008-07-03
Fabricating die with separate test pads selectively coupled to cores Grant 7,368,304 - Whetsel , et al. May 6, 2	2008-05-06
Integrated circuit having electrically isolatable test circuitry App 20070035324 - Antley; Richard L. ; et al.	2007-02-15
Integrated circuit having electrically isolatable test circuitry Grant 7,124,341 - Antley , et al. October 17, 2	2006-10-17
Die testing using top surface test pads App 20060205099 - Whetsel; Lee D. ; et al.	2006-09-14
Fabricating a die with test enable circuits between embedded cores Grant 7,056,752 - Whetsel , et al. June 6, 2	2006-06-06
Die testing using top surface test pads App 20040101985 - Whetsel, Lee D. ; et al.	2004-05-27
Integrated circuit having electrically isolatable test circuitry App 20030140295 - Antley, Richard L. ; et al.	2003-07-24
Die testing using top surface test pads App 20020119650 - Whetsel, Lee D. ; et al.	2002-08-29

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