Anthony; Brian G.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Anthony; Brian G..The latest application filed is for "method for forming a copper interconnect using a multi-platen chemical mechanical polishing (cmp) process".
- Anthony; Brian G. - Austin TX
| Patent | Date |
|---|---|
| Method of forming semiconductor device including interconnect barrier layers Grant 6,713,381 - Barr , et al. March 30, 2 | 2004-03-30 |
| Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process App 20020151167 - Farkas, Janos ; et al. | 2002-10-17 |
| Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process Grant 6,444,569 - Farkas , et al. September 3, 2 | 2002-09-03 |
| Method for forming a barrier layer for use in a copper interconnect App 20020092763 - Denning, Dean J. ; et al. | 2002-07-18 |
| Semiconductor device and method of formation App 20020093098 - Barr, Alexander L. ; et al. | 2002-07-18 |
| Semiconductor Device Conductive Bump And Interconnect Barrier App 20020000665 - BARR, ALEXANDER L. ; et al. | 2002-01-03 |
| Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process App 20010027083 - Farkas, Janos ; et al. | 2001-10-04 |
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