Antesberger; Timothy

Patent Applications and Registrations

Patent applications and USPTO patent grants for Antesberger; Timothy.The latest application filed is for "thermal substrate".

Company Profile

0.13.11

Antesberger; Timothy - Vestal NY US
Antesberger; Timothy - Binghamton NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Coreless layer buildup structure with LGA and joining layer Grant 9,351,408 - Markovich , et al. May 24, 2	2016-05-24
Coreless layer buildup structure Grant 8,541,687 - Markovich , et al. September 24, 2	2013-09-24
Coreless layer buildup structure with LGA Grant 8,536,459 - Markovich , et al. September 17, 2	2013-09-17
Electronic package including high density interposer and circuitized substrate assembly utilizing same Grant 8,405,229 - Antesberger , et al. March 26, 2	2013-03-26
Thermal Substrate App 20130025839 - Egitto; Frank ; et al.	2013-01-31
Method of making high density interposer and electronic package utilizing same Grant 8,245,392 - Antesberger , et al. August 21, 2	2012-08-21
Coreless Layer Buildup Structure App 20120160547 - Antesberger; Timothy ; et al.	2012-06-28
Coreless Layer Buildup Structure With Lga App 20120160544 - Antesberger; Timothy ; et al.	2012-06-28
Power core for use in circuitized substrate and method of making same Grant 8,198,551 - Japp , et al. June 12, 2	2012-06-12
Coreless Layer Buildup Structure With Lga And Joining Layer App 20120031649 - Antesberger; Timothy ; et al.	2012-02-09
Power Core For Use In Circuitized Substrate And Method Of Making Same App 20110284273 - Japp; Robert M. ; et al.	2011-11-24
Method of making high density interposer and electronic package utilizing same App 20110126408 - Antesberger; Timothy ; et al.	2011-06-02
Electronic package including high density interposer and circuitized substrate assembly utilizing same App 20110127664 - Antesberger; Timothy ; et al.	2011-06-02
Method of making circuitized substrate Grant 7,163,847 - Antesberger , et al. January 16, 2	2007-01-16
Method of making circuitized substrate Grant 7,091,066 - Antesberger , et al. August 15, 2	2006-08-15
Method of making circuitized substrate Grant 7,084,014 - Antesberger , et al. August 1, 2	2006-08-01
Circuitized substrate, method of making same and information handling system using same App 20060046462 - Antesberger; Timothy ; et al.	2006-03-02
Circuitized substrate, method of making same and information handling system using same App 20060040426 - Antesberger; Timothy ; et al.	2006-02-23
Circuitized substrate, method of making same and information handling system using same App 20050074924 - Antesberger, Timothy ; et al.	2005-04-07

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